Scientist, Optical Technologies & Flat Optics, IMRE

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research in Singapore seeks a highly motivated Scientist to advance heterogeneous integration and advanced packaging in the Flat Optics Department. You will develop D2W bonding processes for optoelectronic devices including metasurfaces.

You will collaborate with cross-disciplinary teams, contribute to IP through disclosures and patents, and support translational research with industry partners to push cutting-edge optical technologies forward.

Qualifications

• Ph.D. in Physics, Materials Science, Photonics, Electrical Engineering or a related field.
• Advanced packaging, specifically die-to-wafer, wafer-to-wafer, or hybrid bonding.
• Understanding of bond interface physics, alignment/overlay fundamentals.
• Strong analytical, experimental, and problem-solving skills.
• Good team player who can collaborate with industry and academic partners.

Responsibilities

• Develop die-to-wafer bonding processes (surface preparation, plasma activation, high-accuracy placement).
• D2W, W2W bonding of optical structures with cameras and micro-LED displays.
• Electrical testing of devices, and optimization of process to improve yield and alignment precision.
• Work with equipment and material team to develop bonding methods.
• Contribute to intellectual property generation through invention disclosures and patent applications.
• Support translational research and collaborations with industry partners.

Skills

Analytical skills

Experimental skills

Problem-solving

Team collaboration

Education

Ph.D. in Physics, Materials Science, Photonics, Electrical Engineering or related field

Tools

Die-to-Wafer bonding

Wafer-to-Wafer bonding

Hybrid bonding

Job description

Job Description

We are seeking a highly motivated Scientist to join our research team in the field of heterogeneous integration and advanced packaging in the Flat Optics Department under Semiconductor Flagship Initiative. The scientist will develop cutting‑edge D2W (die‑to‑wafer) bonding processes for advanced optoelectronic devices including metasurfaces.

Key Responsibilities

• Develop die‑to‑wafer bonding processes (surface preparation, plasma activation, high‑accuracy placement).
• D2W, W2W bonding of optical structures with cameras and micro‑LED displays.
• Electrical testing of devices, and optimization of process to improve yield and alignment precision.
• Work with equipment and material team to develop bonding methods.
• Contribute to intellectual property generation through invention disclosures and patent applications.
• Support translational research and collaborations with industry partners.

Qualifications

• Ph.D. in Physics, Materials Science, Photonics, Electrical Engineering or a related field.
• Advanced packaging, specifically die‑to‑wafer, wafer‑to‑wafer, or hybrid bonding.
• Understanding of bond interface physics, alignment/overlay fundamentals.
• Strong analytical, experimental, and problem‑solving skills.
• Good team player who can collaborate with industry and academic partners.

Preferred Qualifications

• Experience in cleanroom processes, e.g. thin film deposition, photolithography.
• Experience in imaging sensors and micro‑displays.
• Track record of publications in relevant fields.