Senior Scientist I, Process Integrator / HI, Adv PKg, IME

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

Institute of Microelectronics (IME) in Singapore seeks a Principal Scientist to advance state-of-the-art advanced packaging technologies. You will lead development of heterogenous integration flows for 2.5D/3D packaging and perform reliability characterization.

The role involves mentoring researchers, collaborating with external partners, and driving high-impact projects across flip-chip, FOWLP, interposer, and bonding technologies.

Qualifications

• PhD in a relevant field.
• 5+ years of experience in advanced packaging such as FOWLP, Flip Chip bonding, 2.5D/3D integration.
• Strong analytical and problem-solving skills with data analysis, interpretation and DOE.

Responsibilities

• Develop new process integration flows for flip-chip, hybrid bonding, and FOWLP-based applications.
• Conceive and plan projects involving new materials and advanced process-integration approaches.
• Collaborate with internal and external partners to address technology roadmaps and business challenges.
• Lead high-impact projects with manageable risks and mentor less-experienced colleagues.
• Investigate and refine interposer fabrication integration flows with focus on new materials and TSV fill applications.
• Manage wafer-level and die-level warpage to meet process requirements.
• Optimize die-bonding processes and bonding materials.
• Conduct engineering experiments for process characterization to drive quality and yield improvements.
• Perform reliability characterization of advanced packages to ensure robustness.
• Act as SME for internal and external stakeholders and mentor young talent.

Skills

Advanced packaging expertise

FOWLP / Flip Chip bonding

2.5D/3D heterogeneous integration

Data analysis & DOE

Project leadership

Education

PhD in Materials Science/Engineering or related

Job description

The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Principal Scientist to join our team. This role is pivotal in advancing state-of-the-art advanced packaging technologies such as Filp chip bonding, FOWLP, chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge heterogenous integration process flow for 2.5D and 3D packaging applications, and conducting electrical and reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.

Key Responsibilities

• To develop new process integration flows for flip-chip, hybrid bonding, and FOWLP-based applications.
• Conceive and plan projects involving new materials, advanced process-integration approaches, and innovative concepts.
• Collaborate with internal and external partners to address technology roadmaps, process capability requirements, and business challenges.
• Lead high-impact projects with manageable risks and mentor less-experienced colleagues.
• Demonstrate flexibility in responsibilities and a proactive approach to taking on additional tasks.
• Investigate and refine integration process flows for interposer fabrication, with a focus on new materials such as liner dielectrics, ALD barriers, and copper, and alternative TSV fill applications.
• Explore cost-effective integration for inter-dielectric gap-fill-based processes.
• Manage wafer-level and die-level warpage to meet process requirements.
• Optimize die-bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
• Conduct engineering experiments for process characterization to drive quality and yield improvements.
• Perform reliability characterization of advanced packages such as hybrid-bonded packages, FOWLP, and CPO to ensure robustness and long-term performance.
• Act as a subject matter expert (SME) for both internal and external stakeholders, providing guidance and expertise.
• Inspire and mentor young talent in semiconductor technology, contributing to workforce development in the field.
• Demonstrate teamwork skills with a focus on developing good team dynamics.
• Skilled at effectively prioritizing multiple and sophisticated tasks.

Qualifications

• PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
• 5 years of experience in Advanced packaging such as FOWLP, Flip Chip bonding, Chip to wafer and or wafer to wafer hybrid component integration, 2.5D/3D heterogenous integration applications.
• Knowledge in Advanced packaging materials, process and equipment technologies. Basic knowledge in failure analysis, preferable.
• Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.
• Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
• Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.
• Proven ability to troubleshoot and resolve process-related challenges.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.