Research Fellow: Electrical Modelling for Advanced Packaging

National University of Singapore

Singapore

In loco

SGD 60.000 - 90.000

Tempo pieno

5 giorni fa

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Descrizione del lavoro

The National University of Singapore (NUS) ECE Department seeks a Postdoctoral Research Fellow to develop analytical and equivalent-circuit models for next-generation packaging and high-density interconnects. You will explore 2.5D/3D integration, hybrid bonding, nano-TSVs, backside PDN, and co-packaged optics while examining how geometry, materials, and processes affect electrical performance.

You will combine physics-based modelling with circuit simulation and experimental validation,

Competenze

PhD in Electrical/Electronics Engineering or closely related field.
Experience developing compact models and model libraries for PDKs.
Familiarity with electromagnetic parameter extraction and frequency-dependent interconnect modelling.
Experience with electrical test structures and S-parameter measurements.

Mansioni

Develop physics-based analytical models and lumped or distributed equivalent circuits for advanced interconnects and power delivery structures.
Quantify latency, bandwidth, and energy per bit across interconnects and architectures.
Investigate signal integrity issues including insertion loss, return loss, impedance changes, reflections, and cross-talk.
Analyze power integrity: IR drop, voltage droop, PDN impedance and decoupling effects.
Develop parameterised compact models and reusable interconnect libraries for packaging and interconnect PDKs.
Extract model parameters from simulations, test structures, and measurements; validate models.
Collaborate with fabrication, packaging, device and circuit researchers; publish findings.