Real-Time Defect Analytics Lead – Packaging Metrology

Micron; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

Micron Technology, Inc. is seeking an Advanced Packaging Metrology-RDA Engineer to advance metrology and AI-enabled inspection techniques. You will collaborate across organizations to enable new packaging technologies and drive yield improvements.

You will develop recipes, validate methods, and report progress using PowerBI, SPC, and DOE while engaging with multiple teams to deliver high-performance memory solutions.

Qualifications

• B.S./M.S./Ph.D. in engineering or related technical fields.
• 2+ years in semiconductor process or equipment engineering.
• Proficiency in Python, R, SQL for statistical analysis; Visual Basic experience.
• Familiarity with E3, FDC, and RMS for equipment and process control.
• Strong data analytics to support SPC, DOE, defect analysis, and dashboarding.
• Deep understanding of process flows and yield/reliability impact.
• Hands-on experience with wafer/assembly tools or metrology/RDA systems.
• Ability to work under timelines with limited resources.
• Baseline digital fluency and AI literacy for AI-enabled research and problem-solving.

Responsibilities

• Develop and optimize metrology recipes for semiconductor processes and production needs.
• Establish inspection methodologies and in-line validation of recipes.
• Use PowerBI and other tools to summarize and report metrology status and progress.
• Own metrology tools, set up control plans and SPC charts.
• Collaborate with Package Integration, Front End Wafer Fab, and other teams for seamless integration.
• Integrate AI-enabled tools to improve efficiency, quality, and outcomes.

Skills

Data analytics

Statistical modeling

DOE

Problem solving

AI literacy

Education

B.S./M.S./Ph.D. in Engineering or related field

Tools

Python

R

SQL

Visual Basic

PowerBI

E3

FDC

RMS

Job description

Micron Technology, Inc. is seeking an Advanced Packaging Metrology-RDA Engineer to advance metrology and AI-enabled inspection techniques. You will collaborate across organizations to enable new packaging technologies and drive yield improvements.

You will develop recipes, validate methods, and report progress using PowerBI, SPC, and DOE while engaging with multiple teams to deliver high-performance memory solutions.