Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)

Micron Technology; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

Micron Technology in Singapore is seeking an Advanced Packaging Metrology-RDA Engineer. In this role, you will develop innovative inspection and metrology techniques and collaborate with teams to launch new technologies.

Applicants should possess a degree in relevant engineering fields and have at least 2 years of experience in semiconductor processes. Key skills include Python, R, SQL, data analytics, and familiarity with Power BI.

Qualifications

• 2 or more years of semiconductor process or equipment engineering experience in wafer bonding, plating, or packaging.
• Hands-on experience with wafer/assembly tools or metrology/RDA systems.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

Responsibilities

• Develop and optimize metrology recipes for semiconductor processes.
• Establish inspection methodologies and best-known methods for metrology.
• Utilize data analysis tools like Power BI to summarize and report on metrology recipe status.

Skills

Python

R

SQL

Data analytics

Process modeling

Statistical analysis

Education

B.S./M.S./Ph.D. in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics

Tools

Power BI

E3

FDC (Fault Detection and Classification)

RMS (Recipe Management System)

Job description

Advanced Packaging Metrology‑RDA Engineer

We are looking for an Advanced Packaging Metrology‑RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new metrology and RDA technologies for solutions that drive the future. Additional responsibilities include establishing equipment evaluation and long‑range strategy to enable advanced packaging technology roadmap.

Key Responsibilities

• Recipe Development and Optimization: develop and optimize metrology recipes for various semiconductor processes, ensure that the recipes are accurate and efficient for production needs, develop and execute strategies for process monitoring, sampling, and continuous improvement (CIP).
• Inspection and Characterization: establish inspection methodologies and best‑known methods (BKM) for metrology processes, perform in‑line characterization and validation of metrology recipes.
• Data Analysis and Reporting: utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progress, continuously analyze data to identify improvement opportunities and ensure process efficiency.
• Quality and Performance Indicators: own and manage metrology tools, ensuring they meet performance indicators and quality standards, drive the defense line readiness, set up control plans, OCAP (Out of Control Action Plans), and SPC (Statistical Process Control) charts.
• Collaboration and Coordination: engage in early involvement with APTD to ensure seamless integration of new technologies, work closely with various teams including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control.

Qualifications

• B.S./M.S./Ph.D. (or equivalent education) in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, or other related technical fields.
• 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field.
• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics; experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability.
• Hands‑on experience with wafer/assembly tools or metrology/RDA systems.
• Tenacity to work effectively under timelines and limited resources.
• Consistent track record to solve problems and address root causes.

Equal Opportunity Employer

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.