Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)

Micron; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

Micron Technology, Inc. is seeking an Advanced Packaging Metrology-RDA Engineer to advance metrology and AI-enabled inspection techniques. You will collaborate across organizations to enable new packaging technologies and drive yield improvements.

You will develop recipes, validate methods, and report progress using PowerBI, SPC, and DOE while engaging with multiple teams to deliver high-performance memory solutions.

Qualifications

• B.S./M.S./Ph.D. in engineering or related technical fields.
• 2+ years in semiconductor process or equipment engineering.
• Proficiency in Python, R, SQL for statistical analysis; Visual Basic experience.
• Familiarity with E3, FDC, and RMS for equipment and process control.
• Strong data analytics to support SPC, DOE, defect analysis, and dashboarding.
• Deep understanding of process flows and yield/reliability impact.
• Hands-on experience with wafer/assembly tools or metrology/RDA systems.
• Ability to work under timelines with limited resources.
• Baseline digital fluency and AI literacy for AI-enabled research and problem-solving.

Responsibilities

• Develop and optimize metrology recipes for semiconductor processes and production needs.
• Establish inspection methodologies and in-line validation of recipes.
• Use PowerBI and other tools to summarize and report metrology status and progress.
• Own metrology tools, set up control plans and SPC charts.
• Collaborate with Package Integration, Front End Wafer Fab, and other teams for seamless integration.
• Integrate AI-enabled tools to improve efficiency, quality, and outcomes.

Skills

Data analytics

Statistical modeling

DOE

Problem solving

AI literacy

Education

B.S./M.S./Ph.D. in Engineering or related field

Tools

Python

R

SQL

Visual Basic

PowerBI

E3

FDC

RMS

Job description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. We are looking for an Advanced Packaging Metrology‑RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new metrology and RDA technologies for solutions that drive the future. Additional responsibilities include establishing equipment evaluation and long-range strategy to enable advanced packaging technology roadmap.

Key responsibilities and duties include:

• Recipe Development and Optimization:

  Develop and optimize metrology recipes for various semiconductor processes. Ensure that the recipes are accurate and efficient for production needs. Develop and execute strategies for process monitoring, sampling, and continuous improvement (CIP).

• Inspection and Characterization:

  Establish inspection methodologies and best‑known methods (BKM) for metrology processes. Perform in‑line characterization and validation of metrology recipes.

• Data Analysis and Reporting:

  Utilize data analysis tools like PowerBI to summarize and report on metrology recipe status and project progress. Continuously analyze data to identify improvement opportunities and ensure process efficiency.

• Quality and Performance Indicators:

  Own and manage metrology tools, ensuring they meet performance indicators and quality standards. Drive the defense line readiness and set up control plans, OCAP (Out of Control Action Plans), and SPC (Statistical Process Control) charts.

• Collaboration and Coordination:

  Engage in early involvement with Advanced Packaging Technology Development (APTD) to ensure seamless integration of new technologies. Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control.

• AI Responsibilities:

  Integrates AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work.

Requirements

• B.S/M.S./Ph.D. (or equivalent education) in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, or other related technical fields
• 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field
• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
• Hands on experience with wafer/assembly tools or metrology/RDA systems
• Tenacity to work effectively under timelines and limited resources
• Consistent track record to solve problems and address root causes Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.