Quality Process Engineer: Front-End & Package Risk

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Micron Singapore is seeking a FE Central Quality Process Engineer to lead new product quality risk assessments and deploy quality and reliability control systems across front-end and FE packaging processes.

You will partner with DDQA, Fab PI, cPIE and Fab QE to establish end-to-end QRC, drive pFMEA for change control, and lead cross-functional improvement initiatives to strengthen product quality and WLR metrics.

Qualifications

• Bachelor's degree in Engineering with practical experience.
• 3+ years of semiconductor manufacturing or related roles.

Responsibilities

• Establish end-to-end QRC process with DDQA, Fab PI, cPIE and Fab QE.
• Identify FE-to-package impact and implement pFMEA to govern change control.
• Lead inline control point development with Fab PIE/RAM/QE and central RAM/PIE.
• Support continuous improvement initiatives and problem solving for manufacturing issues.
• Support excursion material disposition through fail mode risk assessment.
• Lead global projects to deploy and improve quality-related systems and processes.
• Share best-known-methods and drive cross-fab QA alignment.
• Drive validation of root cause, CA/PA and manufacturing improvements.
• Collaborate with Test/Product/System/MFG/SMAI to roll out quality initiatives.

Skills

NAND traveler flow

Data-driven decisions

Root cause analysis

Troubleshooting

Education

Bachelor's degree in Engineering

Job description

Micron Singapore is seeking a FE Central Quality Process Engineer to lead new product quality risk assessments and deploy quality and reliability control systems across front-end and FE packaging processes.

You will partner with DDQA, Fab PI, cPIE and Fab QE to establish end-to-end QRC, drive pFMEA for change control, and lead cross-functional improvement initiatives to strengthen product quality and WLR metrics.