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Micron Technology, Inc. in Singapore is seeking a Director of Package Quality & Reliability Engineering to lead qualification, testing, and risk mitigation for new product introductions and high-volume manufacturing across mobile, data center, automotive, and AI workloads.
You will partner with Package Development Engineering and front-end fabs to drive DFR/DFM integration, manage a team, set KPIs, and apply data-driven reliability improvements including AI-enabled analytics.
Micron Technology, Inc. in Singapore is seeking a Director of Package Quality & Reliability Engineering to lead qualification, testing, and risk mitigation for new product introductions and high-volume manufacturing across mobile, data center, automotive, and AI workloads.
You will partner with Package Development Engineering and front-end fabs to drive DFR/DFM integration, manage a team, set KPIs, and apply data-driven reliability improvements including AI-enabled analytics.