GQ FECQE Process Engineer (Open)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Micron Singapore is seeking a FE Central Quality Process Engineer to lead new product quality risk assessments and deploy quality and reliability control systems across front-end and FE packaging processes.

You will partner with DDQA, Fab PI, cPIE and Fab QE to establish end-to-end QRC, drive pFMEA for change control, and lead cross-functional improvement initiatives to strengthen product quality and WLR metrics.

Qualifications

• Bachelor's degree in Engineering with practical experience.
• 3+ years of semiconductor manufacturing or related roles.

Responsibilities

• Establish end-to-end QRC process with DDQA, Fab PI, cPIE and Fab QE.
• Identify FE-to-package impact and implement pFMEA to govern change control.
• Lead inline control point development with Fab PIE/RAM/QE and central RAM/PIE.
• Support continuous improvement initiatives and problem solving for manufacturing issues.
• Support excursion material disposition through fail mode risk assessment.
• Lead global projects to deploy and improve quality-related systems and processes.
• Share best-known-methods and drive cross-fab QA alignment.
• Drive validation of root cause, CA/PA and manufacturing improvements.
• Collaborate with Test/Product/System/MFG/SMAI to roll out quality initiatives.

Skills

NAND traveler flow

Data-driven decisions

Root cause analysis

Troubleshooting

Education

Bachelor's degree in Engineering

Job description

As a FE Central Quality Process Engineer in Micron, you will be responsible for supporting Micron quality initiative by leading new product quality risk assessment as well as deploying Quality & Reliability control system. This role will involve closely working with cross-functional team to assess QnR risk in front-end manufacturing process and FE process on package risk impact. You will ensure product quality through comprehensive control points, specification validation, and disposition measures.

Job Responsibilities:

• Partner with DDQA, Fab PI, cPIE and Fab QE to establish end to end QRC process

• Partner with cross-functional teams to identity FE process to package impact and ensure pFMEA in place to govern process change control.

• Partner with Fab PIE/RAM/QE and central RAM/PIE to establish inline control point

• Tactical support continuous improvement initiatives and problem solving for manufacturing issue.

• Support excursion material disposition through fail mode risk assessment

• Lead global projects to deploy and improve Quality-related systems and business processes

• Partner with quality engineers at other Micron fabs to share best-known-methods and drive cross-fab alignment in QA business processes and methods

• Drive validation of Root cause, CA/PA and Manufacturing improvements for Quality events

• Collaborate with Test/Product/System/MFG/SMAI to deploy and roll out quality initiatives to improve quality/WLR metrics

Minimum Required Qualifications/Experience

• Bachelor’s degree in Engineering (e.g., Materials, Chemical, Mechanical, Electrical) or equivalent practical experience.

• 3+ years of experience in semiconductor manufacturing process, or related technical roles

Must Have Technical Skills

• Knowledge of NAND traveler flow and Fab area process

• Strong model-based problem-solving skills combined with data-driven decision-making and effective presentation abilities. Demonstrated expertise in troubleshooting and resolving process issues, as well as identifying root causes.

Preferred Skills

• The advantages of Knowledge of package process, fail modes and process WLR & pWLR

• Strong organizational capabilities and the ability to work effectively. Demonstrated flexibility with job responsibilities and initiative in assuming additional tasks

• Ability to work independently and collaboratively with cross-functional teams

• Well communication, written and presentation skills