GQ FECQE Process Engineer (Open)

Micron Technology; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Micron Technology is seeking a FE Central Quality Process Engineer to spearhead quality risk assessments for new products and deploy Quality & Reliability control systems across front-end and packaging processes.

You will partner with DDQA, Fab PI, cPIE, and Fab QE to establish end-to-end QRC processes and inline control points. Strong data-driven problem solving and cross-functional collaboration are essential for improving QA metrics.

Qualifications

• Bachelor's degree in Engineering or equivalent practical experience.
• 3+ years of experience in semiconductor manufacturing process or related technical roles.
• Knowledge of NAND traveler flow and Fab area process.
• Strong data-driven decision-making and presentation abilities; troubleshooting and root-cause identification.

Responsibilities

• Lead end-to-end QRC process with cross-functional teams (DDQA, Fab PI, cPIE, Fab QE).
• Identify FE process to package impact and ensure pFMEA governs change control.
• Establish inline control points and quality systems with central RAM/PIE teams.
• Drive continuous improvement initiatives and resolve manufacturing issues.
• Support excursion material disposition through failure mode risk assessments.
• Lead global quality projects and share best-known-methods across fabs.

Skills

NAND traveler flow

Root-cause analysis

Education

Bachelor's degree in Engineering

Job description

As a FE Central Quality Process Engineer in Micron, you will be responsible for supporting Micron quality initiative by leading new product quality risk assessment as well as deploying Quality & Reliability control system. This role will involve closely working with cross-functional team to assess QnR risk in front-end manufacturing process and FE process on package risk impact. You will ensure product quality through comprehensive control points, specification validation, and disposition measures.

Job Responsibilities:

• Partner with DDQA, Fab PI, cPIE and Fab QE to establish end to end QRC process
• Partner with cross-functional teams to identity FE process to package impact and ensure pFMEA in place to govern process change control.
• Partner with Fab PIE/RAM/QE and central RAM/PIE to establish inline control point
• Tactical support continuous improvement initiatives and problem solving for manufacturing issue.
• Support excursion material disposition through fail mode risk assessment
• Lead global projects to deploy and improve Quality-related systems and business processes
• Partner with quality engineers at other Micron fabs to share best-known-methods and drive cross-fab alignment in QA business processes and methods
• Drive validation of Root cause, CA/PA and Manufacturing improvements for Quality events
• Collaborate with Test/Product/System/MFG/SMAI to deploy and roll out quality initiatives to improve quality/WLR metrics

Minimum Required Qualifications/Experience

• Bachelor’s degree in Engineering (e.g., Materials, Chemical, Mechanical, Electrical) or equivalent practical experience.
• 3+ years of experience in semiconductor manufacturing process, or related technical roles

Must Have Technical Skills

• Knowledge of NAND traveler flow and Fab area process
• Strong model-based problem-solving skills combined with data-driven decision-making and effective presentation abilities. Demonstrated expertise in troubleshooting and resolving process issues, as well as identifying root causes.

Preferred Skills

• The advantages of Knowledge of package process, fail modes and process WLR & pWLR
• Strong organizational capabilities and the ability to work effectively. Demonstrated flexibility with job responsibilities and initiative in assuming additional tasks
• Ability to work independently and collaboratively with cross-functional teams
• Well communication, written and presentation skills