Product Development Engineer, Key Equipment for Packaging

Micron Technology; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a PDE KEG Engineer to identify, evaluate, and qualify new equipment platforms supporting advanced packaging technology. You will collaborate with production teams, suppliers, and IT to drive EMI/TOR standards and equipment readiness for mass production.

The role emphasizes innovation, cross‑functional teamwork, and continuous improvement, with exposure to automated tooling, capital planning, and equipment benchmarking in a semiconductor context.

Qualifications

• PhD/Masters/bachelor's degree in electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
• Basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques
• 0-2 years' experience in related semiconductor industry or related manufacturing environment
• Experience with technical knowledge on assembly and/or wafer bumping and/or advanced packaging technology is a plus.
• Understanding and/or experience in equipment automation solutions is a plus
• Fast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teamsand external vendors
• Strong communication (verbal & written) and presentation skills(English speaking is must)
• Understanding business needs and customers' requirement, able to participate in cross functional team environment
• Strong project management skills to ensure execution to timelines
• Seasonal Travel based on business need will be required
• Performs hardware, software engineering assignments as required
• Integrate AI-assisted tools and insights into daily work to improve efficiency, quality or effectiveness.
• Strong analytical, logical, and critical thinking skills
• Growth mindset with a passion for continuous learning
• Internship or experience in the semiconductor industry is a plus
• Demonstrated leadership and a track record of impact are highly desirable
• Interest in and knowledge of the semiconductor industry and Micron is preferred
• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes.

Responsibilities

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work
• Support the evaluation and qualification of new equipment plaforms
• Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap.
• Develop and engage creative solutions for new equipment capabilities/ solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capabilities.
• Engage in active participation in Package Development Engineering activities
• Conducts equipment benchmarking to establish equipment suppliers and platforms for future need
• Assist senior engineers in equipment benchmarking and selection activities
• Evaluate and qualify new equipment platform and handover to production group
• Plan/submit capital request to acquire new Equipment
• Create and owner of purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional teams
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives
• Feedback loop for Continuous Improvement after mass volume production via collaborate with production and High-Volume Manufacturing (HVM) team on existing production equipment enhancement through continuous improvement projects

Skills

Strong communication

Analytical thinking

Leadership

Team collaboration

AI literacy

Education

PhD/Masters/Bachelors in Electrical/Electronic, Materials, Mechanical Eng, Physics

Job description

Micron Technology, Inc. in Singapore is seeking a PDE KEG Engineer to identify, evaluate, and qualify new equipment platforms supporting advanced packaging technology. You will collaborate with production teams, suppliers, and IT to drive EMI/TOR standards and equipment readiness for mass production.

The role emphasizes innovation, cross‑functional teamwork, and continuous improvement, with exposure to automated tooling, capital planning, and equipment benchmarking in a semiconductor context.