Senior Process Engineer - Wet Etch, Clean & Stripping

COPPERCO TALENT SERVICES PTE. LTD.; Singapore; On-site; SGD 60,000 - 100,000; Full time

Job summary

CopperCo Talent Services Pte. Ltd. is seeking a hands-on Process Engineer to develop and qualify wet etch, clean, and stripping processes for semiconductor wafers.

The role focuses on optimizing process parameters to meet CD and cleanliness targets while applying DOE and SPC to improve yield. You will investigate defects, support NPI, and collaborate with multiple teams to meet production goals. Experience in wet chemical processing, contamination control, and statistical analysis tools like JMP

Qualifications

• Bachelor's degree in Chemical Engineering, Materials Science, Chemistry, Semiconductor Engineering or related discipline.
• Minimum 2 years semiconductor manufacturing experience in wet etch, cleaning, stripping, plating, or wafer-level packaging.
• Strong understanding of semiconductor process integration and contamination control.

Responsibilities

• Develop, qualify, and maintain wet etch, clean, and stripping processes for wafers.
• Optimize process parameters to meet critical dimensions and surface cleanliness targets.
• Investigate yield excursions and defects using root cause analysis.
• Design and run DOE experiments to improve yield and reduce costs.
• Collaborate with Equipment, Production, Quality, Product Engineering, and R&D teams.
• Support NPI, process transfers, and technology development activities.
• Evaluate new chemicals, materials, and process technologies.
• Prepare specifications, work instructions, FMEA, control plans, and qualification reports; ensure EHS compliance.
• Drive continuous improvement to increase yield, reduce defects, and cut cycle times.

Skills

Analytical thinking

Troubleshooting

Problem solving

Cross-functional collaboration

Education

Bachelor's degree in Chemical Engineering or related

Tools

JMP

Minitab

DOE

Job description

Responsibilities

• Process Management: Develop, qualify, and maintain wet etch, clean, and stripping processes for semiconductor wafer fabrication and advanced packaging.

• Optimization & SPC: Optimize process parameters to achieve target specifications for critical dimensions, surface cleanliness, and defect performance. Monitor process health using Statistical Process Control (SPC) and implement corrective actions for deviations.

• Defect & Yield Analysis: Investigate yield excursions, defects, and process abnormalities using root cause analysis methodologies.

• Experimental Design: Design and execute Design of Experiments (DOE) to enhance process performance, boost yield, and lower manufacturing costs.

• Cross-Functional Collaboration: Partner with Equipment, Production, Quality, Product Engineering, and R&D teams to resolve technical issues and support production goals.

• NPI & Transfer: Support New Product Introductions (NPI), process transfers, and technology development activities.

• Materials & Equipment Evaluation: Evaluate and qualify new chemicals, materials, and process technologies.

• Documentation & Compliance: Prepare and maintain specifications, work instructions, FMEA, control plans, and qualification reports. Ensure compliance with EHS standards, chemical management procedures, and waste disposal regulations.

• Continuous Improvement: Drive initiatives focused on yield enhancement, defect reduction, cycle-time improvement, and cost savings.

Requirements

• Education: Bachelor’s degree or higher in Chemical Engineering, Materials Science, Chemistry, Semiconductor Engineering, or a related discipline.

• Experience: Minimum 2 years of semiconductor manufacturing experience, preferably in wet etch, cleaning, stripping, plating, or wafer-level packaging processes.

• Technical Knowledge: Strong understanding of semiconductor process integration, wet chemical processing, chemical compatibility, contamination control, and surface preparation techniques.

• Tools & Methodologies: Hands‑on experience with DOE, SPC, FMEA, CAPA, and statistical analysis tools such as JMP or Minitab.

• Equipment Familiarity: Knowledge of wet process equipment, automated wet benches, and chemical delivery systems.

• Soft Skills: Strong analytical, troubleshooting, and problem-solving capabilities.