Senior Process Engineer - Package Pick & Place (12h)

stats chippac pte. ltd.

Singapore

Vor Ort

SGD 42.000 - 66.000

Vollzeit

Vor 2 Tagen
Sei unter den ersten Bewerbenden

Eine vollständige Bewerbung in einer Minute

Maßgeschneiderter Lebenslauf und Anschreiben – versandbereit.

Schaffe es an den ATS-Filtern vorbei

Zusammenfassung

STATS ChipPAC is seeking an Associate role to provide technical and administrative support to Process Engineers in eWLB Backend2 Dept, ensuring total customer satisfaction tied to product quality, productivity and cost effectiveness.

You will perform production line sustaining and support process improvement initiatives, while diagnosing and solving manufacturing issues, and collaborating with engineers and vendors to train staff and resolve problems.

Qualifikationen

  • Diploma or Degree in Electric & Electronic, Mechanical & Mechatronics, Physics Engineering or equivalent.
  • 2 years of relevant experience in Die Pick & Place, Package Pick & Place or Tape & Reel preferred.
  • Positive mindset with ability to adapt to fast-paced working environment.
  • Ability to work on 12 hours rotating shift.

Aufgaben

  • Perform production line sustaining to ensure processes run with quality.
  • Follow up process improvement projects assigned by Process Engineer.
  • Characterize new devices and create recipes in the machine.
  • Respond immediately to investigate and analyze products with problems.
  • Cross-support with line supervisor to clear real-time bottlenecks affecting cycle time and quality.
  • Cross-support with other Associate Engineers to clear equipment downtime.
  • Communicate with Engineers and external vendors to resolve problems and provide training to less experienced staff.

Kenntnisse

Adaptive to fast-paced environment
Shift work ability

Ausbildung

Diploma or Degree in Electrical/Electronic, Mechanical or Mechatronics or Physics Engineering

Jobbeschreibung

STATS ChipPAC is seeking an Associate role to provide technical and administrative support to Process Engineers in eWLB Backend2 Dept, ensuring total customer satisfaction tied to product quality, productivity and cost effectiveness.

You will perform production line sustaining and support process improvement initiatives, while diagnosing and solving manufacturing issues, and collaborating with engineers and vendors to train staff and resolve problems.

Hol dir deinen kostenlosen, vertraulichen Lebenslauf-Check.

oder ziehe deine Datei hierhin.

Similar jobs

Ähnliche Jobs, die dir auch gefallen könnten

Senior Process Engineer – Package Pick & Place Excellence
Senior Process Engineer – Package Pick & Place Excellence

STATS CHIPPAC MANAGEMENT PTE. LTD. • Singapore

Vor Ort
SGD 42.000 - 66.000
Senior Associate Process Engineer - Package pick & place process
Senior Associate Process Engineer - Package pick & place process

STATS CHIPPAC MANAGEMENT PTE. LTD. • Singapore

Vor Ort
SGD 42.000 - 66.000
Senior Associate Process Engineer - Package pick & place process
Senior Associate Process Engineer - Package pick & place process

stats chippac pte. ltd. • Singapore

Vor Ort
SGD 42.000 - 66.000
Senior Process Engineer – Semiconductor Wet/Plate Ops
Senior Process Engineer – Semiconductor Wet/Plate Ops

STATS CHIPPAC MANAGEMENT PTE. LTD. • Singapore

Vor Ort
SGD 70.000 - 110.000
Senior/Associate Process Engineer - Wet & Plate
Senior/Associate Process Engineer - Wet & Plate

STATS CHIPPAC MANAGEMENT PTE. LTD. • Singapore

Vor Ort
SGD 70.000 - 110.000
Senior / Associate Process Engineer - Wafer Backgrind, Laser Mark, Wafer Saw
Senior / Associate Process Engineer - Wafer Backgrind, Laser Mark, Wafer Saw

STATS CHIPPAC MANAGEMENT PTE. LTD. • Singapore

Vor Ort
SGD 42.000 - 64.000
Senior / Associate Process Engineer - Wafer Backgrind, Laser Mark, Wafer Saw
Senior / Associate Process Engineer - Wafer Backgrind, Laser Mark, Wafer Saw

stats chippac pte. ltd. • Singapore

Vor Ort
SGD 42.000 - 66.000
Senior Process Engineer: Ultra-Thin Die Packaging & Scale-Up
Senior Process Engineer: Ultra-Thin Die Packaging & Scale-Up

STATS ChipPAC • Singapore

Vor Ort
SGD 90.000 - 130.000
Process Engineer – Wafer Backgrind, Laser Mark & Saw
Process Engineer – Wafer Backgrind, Laser Mark & Saw

STATS CHIPPAC MANAGEMENT PTE. LTD. • Singapore

Vor Ort
SGD 42.000 - 64.000
Associate Equipment Engineer
Associate Equipment Engineer

STATS CHIPPAC MANAGEMENT PTE. LTD. • Singapore

Vor Ort
SGD 42.000 - 66.000