Senior/Staff Equipment Development Engineer (APTD)

Micron Technology, Inc; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks a Senior/Staff Equipment Development Engineer (APTD) to drive next‑gen wafer and die packaging equipment development.

You will develop hardware, optimize processes, and align roadmaps with manufacturing needs, collaborating with process, packaging, and test teams to deliver robust, scalable solutions. The role emphasizes applying failure analysis, data analytics, and AI-enabled methods to improve capability, productivity, and cost, with a focus on

Qualifications

• 5+ years of semiconductor process or equipment engineering experience.
• Experience in wafer bonding, plating, warpage control and packaging field stacking process equipment TC bonder/ Hybrid Bonder.
• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
• Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware.
• Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe failure.
• Knowledge of semiconductor processing, solid‑state device physics desirable.
• Consistent track record to solve problems and address root causes.
• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

Responsibilities

• Develop and optimize advanced packaging equipment for technology enablement, including wafer‑level packaging and stacking.
• Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity.
• Establish and improve equipment management projects to deliver tech node requirements.
• Evaluate and promote new equipment and materials to enhance process capabilities.
• Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing.
• Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products, including cost, availability, and improvement of hardware and process capability.
• Ensure defense coverage through process, measurement, inspection, and testing.
• Establish correlations between defense mechanisms to identify improvement opportunities.
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities with SMAI team.
• Good knowledge of Wafer Fab Manufacturing system, e.g.: MES, ETO, Autoshell and E3 FDC is preferred.
• Develop hardware roadmaps for 5+ years in post probe wafer and die processing process area.
• Collaborating with process development teams to develop innovative new solutions.
• Performing fundamental research to drive innovative solutions for next‑generation equipment products.
• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives.
• Lead the equipment team to work closely with various teams to integrate manufacturing processes for optimal performance and quality control.
• Lead and ensure smooth transition from new product development, qualification, small volume production to high volume production.
• Constructs forecasts, proposals and strategic/tactical plans based on business data and market intelligence.
• Integrates AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work.

Skills

Python

R

SQL

Data analytics

AI literacy

Education

B.S./M.S./Ph.D. in Materials Science or related fields

Tools

Visual Basic

E3

FDC

RMS

Job description

Req. ID: JR104445 Senior/Staff Equipment Development Engineer (APTD)

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Senior or Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will be primarily responsible for developing and optimizing next generation, first of a kind (FAOK) wafer and die equipment (Post probe wafer and die development) to improve capability, productivity and cost of such equipment. You will take ideas from conception, through equipment and sub‑component development, all the way to implementation in APTD and manufacturing facilities. You will also be required to identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology. Additional responsibilities include coordinating and carrying out equipment evaluation/optimization to implement changes, leading and participating in equipment maturity and availability improvement and cost reduction activities.

You will be working in a highly collaborative atmosphere, interacting with various groups such as process development, manufacturing, and equipment vendors, to ensure robust processes that meet the detailed physical requirements for Micron products. You will grow into an expert engineer, driving post probe wafer and assembly technology roadmaps, which have a direct influence on Micron’s global leadership in semiconductor manufacturing.

Job Description

• Develop and optimize advanced packaging equipment for technology enablement, including wafer‑level packaging and stacking
• Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity
• Establish and improve equipment management projects to deliver tech node requirements
• Evaluate and promote new equipment and materials to enhance process capabilities
• Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing
• Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products. cost, availability, and improve hardware and process capability
• Ensure defense coverage through process, measurement, inspection, and testing
• Establish correlations between defense mechanisms to identify improvement opportunities
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities with SMAI team
• Good knowledge of Wafer Fab Manufacturing system, eg: MES, ETO, Autoshell and E3 FDC is preferred
• Develop hardware roadmaps for 5+ years in post probe wafer and die processing process area
• Collaborating with process development teams to develop innovative new solutions.
• Performing fundamental research to drive innovative solutions for next‑generation equipment products.
• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives
• Lead the equipment team to work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
• Lead and ensure smooth transition from new product development, qualification, small volume production to high volume production
• Constructs forecasts, proposals and strategic/tactical plans based on business data and market intelligence
• Integrates AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work.

Education and Experience

• B.S/M.S./Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.
• 5 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field stacking process equipment TC bonder/ Hybrid Bonder
• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding
• Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware
• Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe failure
• Knowledge of semiconductor processing, solid‑state device physics desirable
• Consistent track record to solve problems and address root causes
• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes

Job Profile(s)

Product Development Engineer 3 - Product Development Engineer 4

Relocation level: (TBD)

Benefits

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Equal Opportunity

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.