Senior Engineer/ Engineer - Thin Film (CVD/PVD/CMP) Equipment

Vanguard International Semiconductor Corporation

Singapore

On-site

SGD 70,000 - 90,000

Full time

2 days ago
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Job summary

Vanguard International Semiconductor Corporation in Singapore seeks an Electronics/Mechatronics Engineer to own, maintain and improve CMP equipment indices, focusing on quality, uptime and cost. Drive preventive maintenance and mentor junior staff.

Coordinate with process and Manufacturing Engineers to meet module objectives, manage spare parts logistics, and optimize maintenance costs. Develop FMEA, CIP participation, and act as a technical expert for the tool.

Qualifications

  • Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering.
  • Strong analytical and interpersonal skills.
  • Ability to lead and coach a team and own responsibilities.

Responsibilities

  • Own, maintain and improve Quality, Uptime and Cost indices for equipment.
  • Sustain equipment KPI and drive continuous improvements.
  • Coordinate with process and Manufacturing Engineers to meet module objectives.
  • Manage logistics for parts to prevent uptime losses during failures.
  • Plan and implement Preventive Maintenance programs for equipment.
  • Mentor subordinates and provide feedback on performance.
  • Document Corrective Action and Best Known Methods for ROI learning.
  • Participate in CIP programs to optimize equipment utilization and maintenance costs.
  • Be the technical expert for the machine specialization.
  • Use SPACE to monitor SPC charts and JMP for engineering experiments.
  • Coordinate new equipment start-up from facilities hookup to acceptance.

Skills

Team player
Interpersonal skills
Written skills
Communication
Analytical skills
Leadership
Integrity
Ownership
MS Office

Education

Electrical Engineering / Electronics / Mechanical / Mechatronics / Microelectronics Engineering

Tools

MS Office

Job description

Job Description

To own, maintain and improve the following indices: Quality, Uptime and Cost.

Sustain equipment KPI and make continuous improvements to enhance the performance.

Monitor and control equipment performance indices. Optimize PM procedures to make it more effective and efficient.

Coordinate with both process and Manufacturing Engineers to ensure work is carried out efficiently to meet module objectives.

Manage the logistics for parts so as to prevent prolonged uptime losses in the case of equipment failure.

Manage the expenditure allocated for equipment maintenance without compromising on quality output.

Continuous improvement of equipment KPI in terms of quality, uptime and costs.

Plan and implement an effective Preventive Maintenance program on equipment.

Coach and Mentor subordinates to ensure that skill level and knowledge are up to date, and continuously give feedback on their work performance.

Document Corrective Action and Best Known Methods, and Fan it out to all for maximum ROI and learning.

Participate in CIP programs to optimize equipment utilization and cost of maintenance.

Become the technical Expert for the respective machine specialization.

Know how to use SPACE to monitor and analyze SPC charts. Know how to use JMP to analyze engineering experiments.

Know how to use measurement instruments effectively in data collection.

Understand FMEA and be able to generate FMEA analysis for new tool. Able to utilize it to identify tool weaknesses and derive the top 3 to 5 risk factors.

Able to create PROMIS (SiView) DC OP and SPC charts.

Coordinate new equipment start-up to support production, from facilities hookup, vendor startup, to acceptance of equipment for production.

Wafer scrap reduction awareness and mindset.

Follow up on SPSR, MRB, 8D, TECN, and ECN documentation for closure of issues / events. Provide guidance to Junior Engineers.

Self audit and update specifications to meet TS16949 Quality Standard requirements.

Set Expectation and carry out performance appraisal for Technician or AE as instructed by Section Manager.

Requirements
  • Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
  • Min 3 years of relevant work experience in Thin Film CMP Equipment.
  • An excellent team player with good interpersonal, communication and written skills
  • Strong logical thinking capability and good analytical skill
  • High level of integrity with strong leadership attributes to lead and coach a team
  • Highly committed with good ownership and accountability
  • Able to adapt in a fast pace environment and work under pressure
  • Proficient in MS Office Applications
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