PRINCIPAL ENGINEER – FE OCT CPEE HVM DRY ETCH

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd is seeking a Fab Engineer in Singapore. This role involves developing and optimizing processes while enhancing product quality and reliability through collaboration and strategic engagements with teams across the globe.

Candidates should have a Bachelor's or Master's degree in Engineering, along with extensive experience in semiconductor equipment and process management in Dry Etch. The role emphasizes innovation, safety, and continuous improvement.

Qualifications

• Proven track record in maturing tool performance and plasma process parameters.
• Extensive experience with abnormal analysis and implementing improvements.
• Strong adherence to safety, quality, and sustainability standards.

Responsibilities

• Develop and optimize processes for product quality and reliability.
• Lead yield improvement and cost-reduction activities.
• Collaborate with cross-functional teams for defect reduction.

Skills

Semiconductor equipment knowledge

Process management in Dry Etch

Analytical skills

AI-enabled tool application

Education

Bachelor's or Master's degree in Engineering or related field

Tools

LAM Kiyo / Flex / Vantex / Versys

TEL Tactras / RK

AMAT Sym3 / Centura

Job description

Responsibilities

As a Fab Engineer at Micron Technology, Inc., you will work with a team of process and equipment engineers to start up, develop, and optimize processes that improve product quality and reliability. This role involves process yield improvement, cost reduction, productivity enhancement, risk management, and the resolution of manufacturing line problems.

Key responsibilities include identifying, diagnosing, and resolving process‑related problems using failure analysis, FMEA, 8D, or SPC methodology. You will coordinate and carry out process, equipment, and material evaluation/optimization to implement changes at the process step, lead yield improvement and cost‑reduction activities, handle new process baseline qualifications, and manage, audit, and liaise with material suppliers to achieve quality, cost, and risk management objectives.

You will strategize and lead productivity, yield, quality, and cost improvement engagements with global sites and the network team through plasma process optimization, new/FOAK chemistry & hardware qualification, and CIP development collaboration with dry etch suppliers. Collaboration with cross‑functional teams will drive breakthroughs in defect reduction, particle/residue control, CD uniformity, profile control, and chamber‑matching across the global fleet.

Responsibilities also include developing the process and hardware CIP roadmap for Dry Etch—covering chamber parts, RF/match networks, gas delivery, ESC, endpoint, and plasma source upgrades. You will drive process and hardware improvement with an emphasis on safety, defect reduction, cost efficiency, throughput, quality, and sustainability across Dry Etch modules (Conductor Etch, Dielectric Etch, Poly/Gate Etch, Metal Etch, High‑Aspect‑Ratio (HARC) Etch, Spacer/ALE, etc.).

You will partner with suppliers to establish equipment start‑up acceptance criteria, chamber qualification flows, and tool service requirements; work with global facilities to address new tool installation requirements (abatement, exhaust, RF compliance, gas/chemical infrastructure). Additionally, you will improve tool efficiency, WPD, and utilization across all Micron Dry Etch fleets through benchmarking, MAXOUT‑style productivity programs, and path‑finding solutions.

Set up IoT/FDC sensors and advanced chamber telemetry for defense‑line strengthening in Dry Etch tools, and develop new solutions for excursion prevention and chamber‑health monitoring. Establish and improve process windows and recipe robustness, upgrade process capability (CD, profile, selectivity, ARDE, LER/LWR control), and reduce production costs through consumable lifetime extension and gas usage optimization.

Enable new solutions for energy savings (RF power optimization, eco‑mode), PFC/F‑gas abatement, and waste reduction aligned with Micron’s sustainability targets. Integrate AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contribute to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within your scope of work.

Qualifications

• Bachelor's or Master's degree in Engineering (Chemical, Electrical, Materials), Physics, Materials Science, or a related field, or equivalent experience.
• Extensive experience in semiconductor equipment and process management in Dry Etch (e.g., LAM Kiyo / Flex / Vantex / Versys, TEL Tactras / RK, AMAT Sym3 / Centura, or equivalent platforms).
• Proven track record in maturing tool performance and establishing plasma process parameters for dry etch equipment.
• Experience in abnormal analysis (FDC, SPC excursions, chamber‑matching deviations) and improvement, with a solid history of successful project implementation across DRAM and/or NAND flows.
• Proven experience in plasma process and hardware improvement and development within the semiconductor industry, specifically in Dry Etch.
• Remarkable skill in developing and implementing hardware CIP roadmaps and start‑up acceptance criteria for dry etch chambers and consumable parts.
• Strong analytical skills for evaluating, promoting, and planning new etch platforms, chemistries, and chamber kits (e.g., new electrode materials, edge rings, focus rings, showerheads).
• Tangible results in boosting tool performance, establishing process parameters, and streamlining process management projects.
• Ability to strictly adhere to safety, quality, and sustainability standards while driving innovative solutions.
• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.