Principal Engineer, Advanced Thin-Film Deposition

Micron; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Technology, Inc. is seeking a highly motivated engineer for the Technology Development team focused on advanced thin film deposition for next-generation memory technologies.

Responsibilities range from process development to technical leadership (Principal/Staff level) in a collaborative environment. The role requires expertise in ALD, LPCVD, PECVD, and PVD, strong data analytics skills, and the ability to mentor junior engineers while defining technology roadmaps to drive innovation and

Qualifications

• PhD or Master’s degree in a relevant field.
• Minimum 5 years (PhD) or 8 years (Master) hands-on experience in advanced thin film deposition, characterization or related semiconductor field.

Responsibilities

• Develop and optimize advanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) for cutting-edge device architectures.
• Design and execute DOE experiments to improve process capability, uniformity, and reliability.
• Perform in-depth root-cause analysis using advanced modeling and characterization techniques.
• Collaborate with integration, metrology, and equipment engineering teams to solve technical challenges.
• Drive innovation in film deposition for improved performance, cost efficiency, and sustainability.
• Utilize advanced data analytics and modeling to predict process behavior and accelerate development cycles.
• Define technology roadmaps and lead strategic research initiatives; generate IP and influence future deposition directions.
• Mentor junior engineers and lead multi-disciplinary technical projects.

Skills

ALD

LPCVD

PECVD

PVD

film growth mechanisms

surface chemistry

plasma physics

thermodynamics

chemical kinetics

reaction engineering

DOE

SPC

process simulation tools

data analytics

machine learning

TEM

SEM

XPS

SIMS

XRD

AFM

ellipsometry

root-cause analysis

predictive modeling

Education

Ph.D in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field

Master with minimum 8 years hands-on experience in advanced thin film deposition

PhD with minimum 5 years hands-on experience in advanced thin film deposition

Job description

Micron Technology, Inc. is seeking a highly motivated engineer for the Technology Development team focused on advanced thin film deposition for next-generation memory technologies.

Responsibilities range from process development to technical leadership (Principal/Staff level) in a collaborative environment. The role requires expertise in ALD, LPCVD, PECVD, and PVD, strong data analytics skills, and the ability to mentor junior engineers while defining technology roadmaps to drive innovation and