Package Silicon Technology Node Development Director/DMTS

1000 Micron Technology, Inc.

Singapore

On-site

SGD 150,000 - 250,000

Full time

14 days+

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Job summary

1000 Micron Technology, Inc. in Singapore is seeking a PDE Director/DMTS, focusing on technical leadership in chip package interaction technology. The role requires leading global teams and establishing technology roadmaps for silicon technology transitions.

The ideal candidate will have over 15 years of experience in related fields, an advanced degree, and expertise in semiconductor processes. Strong communication skills are essential for collaborating effectively with technical and non-technical partners.

Qualifications

  • 15+ years of proven experience in related fields.
  • Experience with chip package interactions and reliability testing.
  • Excellent communication skills with the ability to convey technical concepts.

Responsibilities

  • Lead global technical silicon teams.
  • Develop and communicate silicon technology roadmaps.
  • Collaborate with engineering teams on process integration and development.

Skills

Process technology development
Memory technologies
Chip-package-interaction failure mechanisms
Strong presentation skills
Relationship building

Education

Master’s or Ph.D. in relevant fields

Job description

Our vision is to transform how the world uses information to enrich life for all. We are an inclusive team passionate about leveraging expertise in the relentless pursuit of innovation for customers and partners. The solutions we build enable virtual reality experiences and breakthroughs in neural networks, while committing to integrity, sustainability, and community impact.

The PDE Director/DMTS role focuses on technical leadership in developing and maintaining chip package interaction technology roadmaps and strategies for advanced silicon technology node transitions in packaging.

Responsibilities
  • Leading global technical silicon teams
  • Developing and communicating silicon technology roadmaps and working closely with multiple fab sites on advanced memory technology transitions
  • Collaborating with engineering teams in fab process integration, assembly design and development, and product design and development to establish CPI risk mitigation strategies
  • Regularly aligning priorities, timelines, and resource needs with management and stakeholders to keep silicon technology and test vehicles working seamlessly with design & process requirements
Requirements and Background
  • Good understanding and experience with process technology development business processes and strategy
  • Understanding of memory technologies and processing, as well as semiconductor processing and devices
  • Expertise in chip-package-interaction failure mechanisms and risk assessments
  • Demonstrated ability to form collaborations (internal and external) and with internal customers
  • Ability to work on multiple projects and address cross-disciplinary and cross-organizational issues
  • Strong presentation skills and experience
  • Strong relationship building and matrix management skills
  • Proven ability to solicit feedback, accept input, and analyze success/failure of self and team
How to Qualify
  • Master’s or Ph.D. degree or higher in Materials Science/Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a similar field is preferred
  • 15+ years of proven experience in related fields
  • Experience with chip package interactions, semiconductor electrical/physical failure mechanisms, failure analysis, testing/screening methods, and reliability testing
  • Documented record of technical expertise and innovation resulting in high-impact results; publications, patents, and a track record of technical leadership and mentoring
  • Excellent communication skills with the ability to convey sophisticated technical concepts to both technical and non-technical partners
Equal Opportunity Employer

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

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