Our vision is to transform how the world uses information to enrich life for all. We are an inclusive team passionate about leveraging expertise in the relentless pursuit of innovation for customers and partners. The solutions we build enable virtual reality experiences and breakthroughs in neural networks, while committing to integrity, sustainability, and community impact.
The PDE Director/DMTS role focuses on technical leadership in developing and maintaining chip package interaction technology roadmaps and strategies for advanced silicon technology node transitions in packaging.
Responsibilities
- Leading global technical silicon teams
- Developing and communicating silicon technology roadmaps and working closely with multiple fab sites on advanced memory technology transitions
- Collaborating with engineering teams in fab process integration, assembly design and development, and product design and development to establish CPI risk mitigation strategies
- Regularly aligning priorities, timelines, and resource needs with management and stakeholders to keep silicon technology and test vehicles working seamlessly with design & process requirements
Requirements and Background
- Good understanding and experience with process technology development business processes and strategy
- Understanding of memory technologies and processing, as well as semiconductor processing and devices
- Expertise in chip-package-interaction failure mechanisms and risk assessments
- Demonstrated ability to form collaborations (internal and external) and with internal customers
- Ability to work on multiple projects and address cross-disciplinary and cross-organizational issues
- Strong presentation skills and experience
- Strong relationship building and matrix management skills
- Proven ability to solicit feedback, accept input, and analyze success/failure of self and team
How to Qualify
- Master’s or Ph.D. degree or higher in Materials Science/Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a similar field is preferred
- 15+ years of proven experience in related fields
- Experience with chip package interactions, semiconductor electrical/physical failure mechanisms, failure analysis, testing/screening methods, and reliability testing
- Documented record of technical expertise and innovation resulting in high-impact results; publications, patents, and a track record of technical leadership and mentoring
- Excellent communication skills with the ability to convey sophisticated technical concepts to both technical and non-technical partners
Equal Opportunity Employer
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.