MTS - Adv Pkg TD Integrator

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 100,000 - 150,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking a highly qualified individual for the role focused on developing advanced packaging process solutions. Candidates should possess extensive experience in the semiconductor industry along with a suitable educational background in engineering fields.

The position will involve ensuring product quality and improving processes through innovative technologies, while also managing projects effectively in a collaborative environment.

Qualifications

• 10 years' or more experience in the semiconductor industry, preferably in R&D or technology development.
• Experience in Frontend fab Process integration or Module process.
• Ability to integrate & cooperate with people from cross‑function teams.

Responsibilities

• Develop advanced packaging process solutions for all advanced packaging products.
• Lead new Technode process readiness and improve yield, quality, and reliability.
• Ensure smooth transition from new process development to small volume production launch.

Skills

Failure analysis methodologies

DRAM/NAND technology

Project management

Data analytics platforms

Simulation tools

Strong communication skills

Education

PhD, Master’s or Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent

Tools

Simulation tools

Data analytics platforms

Job description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities.

Responsibilities

• Develop advanced packaging process solutions and ensure New Process, New Equipment, New Material and Path finding activities succeed for all advanced packaging products in Micron.
• Lead new Technode process readiness and improve yield, quality and reliability through process characterization, optimization, and introduction of new materials, machines & technologies.
• Enable best technology for New Technode with packaging requirements, drive & collaborate with cross‑functional teams to resolve process related problems.
• Ensure smooth transition from new process development, first qualification success to small volume production launch.
• Develop and qualify new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule.
• Perform CPI NUDD, process TRA, risk mitigation execution and process recipe readiness prior silicon arrives and ensure first pass rate.
• Identify path‑finding opportunities for Micron’s technology leadership with BIC time to market, continuous yield improvement, cost efficiency & touchpoint optimizations.
• Integrate process knowledge between upstream and downstream across Si and assembly/packaging process.
• Stay informed on future trends, technology and capabilities required for future packaging solutions and work with teams to put in place new capabilities to enhance process performance.
• Provide new solutions on time to meet company and customer needs; define, develop and establish process capabilities, strategy and roadmap.
• Engage creative solutions for new capabilities or to overcome identified process constraints ahead of product requirements.

Qualifications

• PhD, Master’s or Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent.
• 10 years’ or more experience in the semiconductor industry, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.
• Experience in DRAM/NAND technology.
• Experience in Frontend fab Process integration or Module process.
• Experience in Backend advanced packaging wafer/ die level process or integration.
• Experience in temporary/permanent bonding technology (Wafer on wafer, Chip on wafer) and understanding of silicon integration and how it interacts at backend process & package level through CPI.
• Proficiency with simulation tools and data analytics platforms for performance analysis and optimization.
• Technical journals or patents being published internally or externally.
• Strong project management skills to ensure execution to timelines.
• Strong communication and presentation skills.
• Understanding of business needs and customers’ requirements.
• Ability to integrate & cooperate with people from cross‑function teams.

Equal Opportunity & Compliance

• All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
• Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
• Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment.