Director, Package Quality and Reliability

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 150,000 - 200,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd in Singapore is looking for a Director of Package Quality & Reliability Engineering to lead the execution and continuous improvement of package reliability and failure analysis for new product introductions and high-volume manufacturing.

This position involves identifying key risks, ensuring robust package performance across diverse applications, and managing a team of engineers to drive capability building and adherence to quality standards.

Qualifications

• 12+ years of experience in semiconductor packaging, reliability, or manufacturing.
• 5+ years of experience in people management or technical leadership roles.
• Experience in high-volume manufacturing environments with exposure to package quality and reliability.

Responsibilities

• Lead execution of package reliability qualification for new product introductions.
• Identify and resolve key reliability risks.
• Drive improvements in reliability test coverage and methodologies.
• Ensure robust qualification processes and reliability sign-off readiness.
• Collaborate with internal stakeholders on package quality and reliability topics.

Skills

Semiconductor packaging technologies

Package reliability test methodologies

Failure analysis techniques

Leadership and team development

Structured problem-solving

Education

Bachelor’s degree in Materials Science, Mechanical Engineering, or related field

Master’s or Ph.D.

Job description

Job Summary

The Director, Package Quality & Reliability Engineering leads the execution and continuous improvement of package reliability, qualification, and failure analysis across new product introductions (NPI) and high-volume manufacturing (HVM). This role is responsible for ensuring robust package quality and reliability performance, identifying and mitigating key risks, and enabling successful product ramps across diverse application segments including mobile, automotive, data center, and AI/HPC.

Main Responsibilities

• Lead execution of package reliability qualification for new product introductions and ongoing reliability monitoring in high-volume manufacturing
• Identify and resolve key reliability risks, including chip-to-package interaction (CPI), interconnect reliability, thermo-mechanical stress, and material-related failure mechanisms
• Drive improvements in reliability test coverage and methodologies, aligned to end-use application requirements (e.g., automotive, mobile, data center)
• Ensure robust qualification processes, test plans, and reliability sign‑off readiness
• Partner with Package Development Engineering (PDE) to integrate Design for Reliability (DFR) and Design for Manufacturability (DFM) into package design
• Collaborate with front‑end fab teams to address integration challenges across silicon and packaging interfaces
• Work with internal stakeholders and support customer engagements on package quality and reliability topics
• Provide technical input and recommendations for risk assessment, including new package qualifications, process/material changes, and manufacturing excursions
• Lead or support failure analysis and root cause investigations using structured methodologies (e.g., 8D) for quality issues, qualification failures, and field returns
• Support data‑driven evaluation of reliability performance and risk mitigation plans
• Lead and develop a team of engineers focused on package reliability, qualification, and failure analysis
• Drive team capability building, training, and adherence to engineering and quality standards
• Establish clear operating rhythms, KPIs, and execution discipline to ensure consistent delivery
• Manage budgets and resource planning, including support for reliability testing infrastructure

Other Responsibilities

• Support alignment across Product Engineering, Manufacturing, and Quality teams to ensure smooth product qualification and ramp
• Drive continuous improvement initiatives in reliability methodologies, failure analysis, and operational processes
• Contribute to strengthening reliability data analytics and digital capabilities
• Provide escalation support on critical reliability and quality issues impacting production or customer commitments
• Support supplier interactions related to package reliability and materials performance
• Leverage AI‑enabled tools and data analytics to improve reliability insights, failure analysis efficiency, and decision‑making
• Identify opportunities to enhance testing, monitoring, and risk detection using digital and predictive approaches
• Promote responsible adoption of AI to improve engineering productivity and outcomes

Candidate Profile / Job Requirements

Minimum Required Qualifications / Experience

• Bachelor’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or related field (Master’s or Ph.D. preferred)
• 12+ years of experience in semiconductor packaging, reliability, or manufacturing
• 5+ years of experience in people management or technical leadership roles
• Experience in high-volume manufacturing environments with exposure to package quality and reliability

Must Have Technical Skills

• Strong understanding of semiconductor packaging technologies and materials
• Experience in package reliability test methodologies (e.g., temperature cycling, HAST, MSL/pre‑conditioning, board-level reliability) and applicable standards (JEDEC, AEC‑Q)
• Working knowledge of failure analysis techniques (e.g., cross‑sectioning, SAM, X‑ray, SEM/EDX) and root cause analysis
• Understanding of chip-to-package interaction, thermo‑mechanical stress, and reliability failure mechanisms
• Familiarity with qualification processes, reliability testing, and risk assessment approaches

Must Have Soft Skills

• Strong leadership and team development capabilities
• Effective collaboration across cross‑functional engineering and manufacturing teams
• Structured problem‑solving and decision‑making skills
• Clear communication skills with the ability to engage both technical and non‑technical stakeholders
• Ability to manage priorities and deliver results in a fast‑paced environment

Highly Desirable / Preferred

• Demonstrates baseline digital fluency and ability to apply AI‑enabled tools for data analysis, problem‑solving, and operational improvement
• Uses AI responsibly in line with organizational standards and governance
• Experience with memory products (DRAM, NAND, HBM) in high-volume manufacturing
• Exposure to advanced packaging technologies (e.g., system-in-package, hybrid bonding)
• Experience supporting automotive or AI/HPC reliability requirements
• Familiarity with predictive reliability analytics or digital quality systems
• Experience working with OSATs, suppliers, or external manufacturing partners

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.