Staff Engineer, Package Development & Engineering

Micron Technology; Singapore; On-site; SGD 120,000 - 150,000; Full time

Job summary

Micron Technology is looking for a PDE Pillar Lead in Singapore to provide technical leadership for advanced packaging initiatives. The role includes owning the full lifecycle of technology pillars, developing standardized methodologies, and aligning objectives with the organization's mission. Candidates should have a relevant degree and over 8 years of experience in semiconductor packaging. Strong leadership and communication skills are essential.

Qualifications

• 8+ years of experience in semiconductor packaging or related fields.
• Proven track record leading complex technical programs.
• Deep understanding of advanced packaging flows.

Responsibilities

• Own the full lifecycle of PDE technology pillars.
• Develop standardized methodologies for program management.
• Align pillar objectives with PDE’s mission and communicate progress.

Skills

Technical leadership

Program execution

Cross-functional team leadership

Technical communication

Yield performance

Education

Bachelor’s or Master’s degree in Engineering or related field

Job description

The PDE Pillar Lead will provide technical leadership and strategic oversight for advanced packaging initiatives within the Advanced Packaging & Technology Development organization. This role is accountable for driving technology enablement, yield acceleration, and seamless integration of next-generation packaging solutions. The Pillar Lead will establish governance frameworks, optimize development workflows, and ensure alignment with PDE’s charter to deliver cutting‑edge packaging technologies.

Key Responsibilities

Technical Leadership & Program Execution

• Own the full lifecycle of PDE technology pillars, including roadmap definition, execution, and closure.
• Define technical objectives, key deliverables, and resource allocation for pillar initiatives.
• Lead cross‑functional engineering teams across TD, HVM, CPI, DRAM, and NPI to achieve aggressive technology milestones.

Governance & Operational Excellence

• Develop and enforce standardized methodologies for technical program management and pillar governance.
• Drive CapEx/OpEx planning, PTM and MOR processes, and integration of BOP design systems.
• Ensure compliance with internal governance models and customer technical requirements.

Strategic Alignment & Technical Communication

• Align pillar objectives with PDE’s mission to embed analytics, simulation, and advanced modeling into development workflows.
• Facilitate technical communication across BU, PDT, TPM, and central engineering teams.
• Provide leadership updates on technical progress, risks, and mitigation strategies.

Performance & Continuous Improvement

• Define and monitor KPIs for technology maturity, yield performance, and EOL accountability.
• Conduct technical reviews to validate outcomes and capture lessons learned.
• Mentor engineers and promote best practices for technical program management.

Qualifications

• Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical discipline.
• 8+ years of experience in semiconductor packaging, process integration, or technology development.
• Proven ability to lead complex, cross‑functional technical programs in a high‑tech environment.
• Deep understanding of advanced packaging flows including hybrid bonding, CoWoS, and chiplet integration.
• Strong technical communication and leadership skills.

Preferred Skills

• Familiarity with Micron’s PDE, CPI, and NPI frameworks.
• Expertise in simulation modeling, yield enhancement, and defectivity analysis.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.