NPI Engineer

Apple; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

Apple in Singapore seeks an NPI Engineer to act as a communication channel between internal cross-functional teams and external project stakeholders. You will manage project timelines, resource planning, and lead technical discussions.

The role includes leading design reviews, build results consolidation, and post-mortem analyses. Preferred candidates have CAD proficiency, DP/FMEA knowledge, SPC experience, and hands-on manufacturing process exposure such as camera modules or MEMS packaging.

Qualifications

• Degree in Science/Engineering/Physics/Materials or equivalent.
• 3–5 years leading product development and qualification for module packages like camera, MEMS.
• Experience leading cross-functional project discussions and reviews.

Responsibilities

• Lead project requirements, product design, and tooling reviews with cross-functional teams.
• Review and consolidate project build results, post-mortem analysis, and improvement plans.
• Drive insights, CAPA actions, and cross-functional problem analysis and resolution.

Skills

Project management

Cross-functional collaboration

Root cause analysis

SPC

FMEA

Technical discussion leadership

Education

STEM degree (Science/Engineering/Physics/Materials)

Tools

Siemens NX

SolidWorks

AutoCAD

Job description

• An NPI (New Process Introduction) Engineer acts as a communication channel between internal Singapore Technology Centre cross-functional teams and external Project stakeholders.


• The role requires both project management for project timelines, resource planning and technical proficiency of leading technical discussions.


• Key responsibilities include leading project requirements, product design, and tooling reviews with cross-functional teams.


• An NPI engineer leads the review and consolidation of project build results, post-mortem analysis, improvement plans, insights, and cross-functional group problem analysis and resolution.

Minimum Qualifications

• Degree of Science in Engineering, Physics, Materials or equivalent


• 3 to 5 years experience on leading product development and qualification for module packages like camera, MEMs.

Preferred Qualifications

• Proficiency in CAD software (e.g., Siemens NX, SolidWorks, AutoCAD) for product design evaluation and collaboration.


• Familiarity with DFM/DFA (Design for Manufacturability/Assembly) principles.


• Understanding of statistical process control (SPC) and failure mode and effects analysis (FMEA).


• Hands-on knowledge of manufacturing processes (e.g. Transfer molding, Semiconductor packaging, Camera module process).


• Experience with Bill of Materials (BOM) management.


• Ability to interpret technical drawings and specifications.


• Proficiency in project management skills.


• Experience in root cause analysis and implementing corrective/preventive actions.