NPI Back-End Process Engineer, Imaging Sensor Ops

STMICROELECTRONICS ASIA PACIFIC PTE LTD

Singapore

On-site

SGD 120,000 - 180,000

Full time

9 days ago

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

STMICROELECTRONICS ASIA PACIFIC PTE LTD in Singapore seeks an engineering leader to drive and qualify new product introductions for advanced Imaging Sensor packaging, from concept to high volume, with Process R&D, Manufacturing and Suppliers Management.

The role demands strong technical skills, stakeholder management and data-driven decision making to lead back-end technology programs across SE Asia, Europe and the USA, with travel as needed.

Qualifications

Bachelor's or Master's degree in Engineering or related field.
Experience with CMOS image sensors or advanced packaging.
Experience in IC/electronics industrialization from concept to volume production.
Strong data analysis with JMP and MATLAB.
Independent worker in a multicultural, cross-functional environment.

Responsibilities

Drive alignment among diverse stakeholders to achieve goals.
Coordinate back-end process technology development from concept to mass production.
Lead cross-team execution with risk mitigation and program coordination.

Skills

CMOS image sensors

Advanced packaging

IC/Electronics industrialization

Stakeholder management

Autonomy & leadership

Education

Bachelor's or Master’s in Engineering

Tools

JMP

MATLAB

Job description

The role demands strong technical skills, stakeholder management and data-driven decision making to lead back-end technology programs across SE Asia, Europe and the USA, with travel as needed.

Get your free, confidential resume review.

or drag and drop your file here.