Engineer, Back-end Operation

STMICROELECTRONICS ASIA PACIFIC PTE LTD; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

STMICROELECTRONICS ASIA PACIFIC PTE LTD in Singapore seeks an engineering leader to drive and qualify new product introductions for advanced Imaging Sensor packaging, from concept to high volume, with Process R&D, Manufacturing and Suppliers Management.

The role demands strong technical skills, stakeholder management and data-driven decision making to lead back-end technology programs across SE Asia, Europe and the USA, with travel as needed.

Qualifications

• Bachelor's or Master's degree in Engineering or related field.
• Experience with CMOS image sensors or advanced packaging.
• Experience in IC/electronics industrialization from concept to volume production.
• Strong data analysis with JMP and MATLAB.
• Independent worker in a multicultural, cross-functional environment.

Responsibilities

• Drive alignment among diverse stakeholders to achieve goals.
• Coordinate back-end process technology development from concept to mass production.
• Lead cross-team execution with risk mitigation and program coordination.

Skills

CMOS image sensors

Advanced packaging

IC/Electronics industrialization

Stakeholder management

Autonomy & leadership

Education

Bachelor's or Master’s in Engineering

Tools

JMP

MATLAB

Job description

Job Summary

Drive & qualify new product introduction (NPI) with new back-end technology bricks for advanced Imaging Sensor package (Optical Module, Chip Scale Package) from early concept through high volume in collaboration with internal Process R&D, Manufacturing and Suppliers Management organization.

Coordinate & collaborate to solve complex technical bottlenecks in back-end technology process. Assess process changes & excursions supporting quality organization with internal and external customers.

It requires strong technical skills, solid stakeholder management and negotiation abilities, individual leadership and a multi-cultural approach. The role carries a high level of autonomy, accountability and decision-making skills together with the ability to lead complex international initiatives with a strong data driven mindset and influence stakeholders at multiple organizations levels.

Key focus includes technical gap assessment, Gross margin improvement & manufacturing performance to meet operations targets. On-time execution & technical issues solving to meet New Product Introduction milestones with full compliance on sustainability and quality requirement.

The Job requires flexibility to travel in South-East Asia (ST sites & Suppliers) & occasionally in Europe & USA.

Key responsibilities

• Drive alignment among diverse stakeholders (Package R&D, QMT, Quality, Planning, BU) to achieve common business, technology, and operational goals
• Coordinating Back-end process technology development & qualification from early concept to Mass Production ramp involving direct interactions with end customers.
• Drive execution with multiple teams through structured coordination, tight follow-up to ensure program alignment and risk mitigation.

Requirements

• Bachelor / Master’s degree in Engineering, Mechanical Engineering, Industrial Engineering, or Materials Science
• Experience in CMOS image sensors or advanced packaging technology
• Experience in IC or electronics industrialization from early concept to volume production
• Established experience of technical issues solved to meet critical milestones with strong knowledge on key data software analysis such asJMPandMATLAB
• Able to work independently with minimal supervision and collaborate effectively in a multicultural team