Senior Package Integration Engineer (NPI to Volume)

Micron Memory Malaysia Sdn Bhd

Singapore

On-site

SGD 90,000 - 150,000

Full time

14 days+

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Job summary

Micron Memory Malaysia Sdn Bhd seeks a PIE Senior Engineer/Engineer in Singapore to drive NPI to volume, ensuring first-pass qualification and timely handover. You will collaborate with TPM/PMO, TD, DESIGN and Site Engineering to meet yeld, quality and handover criteria.

Required are a strong background in backend packaging, test/module processes, and JMP-based data analysis. You’ll lead data-driven decisions and work across teams to bring new products to high-volume production.

Qualifications

Masters or Bachelor's degree in Engineering (Mechanical, Material, Chemical).
8+ years in MNC semiconductor industry for mobile/automotive.
Strong backend package knowledge and packaging development.
Experience with test/module manufacturing processes and package reliability.
Proficient in data analysis and JMP; able to drive data-driven decisions.

Responsibilities

Lead NPIs as Product Owner with cross-functional teams to meet objectives.
Coordinate product start-up and first-pass qualification to ramp to volume.
Communicate product start-up datelines, applications and customer needs to the team.
Collaborate with process/equipment/manufacturing/planning to volume production.
Monitor yield, QDR, reliability; ensure control and escalate early issues.
Own product life cycle from NPI to EOL; address new tech challenges ahead of market.
Serve as point of contact to TPM on product matters.