Memory Systems Pathfinding Architect

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a Package Pathfinding Architect to define next-generation memory packaging architectures, optimizing speed, bandwidth, power, and thermal performance across silicon, package, and system levels.

You will collaborate with silicon, board, and system design teams and key customers to translate long-term packaging roadmaps into scalable products, including AI-enabled design automation and measurement tooling.

Qualifications

• Master’s degree or equivalent in EE, CE, CS, or related field.
• At least 5 years of relevant industry experience in package design, electrical simulations and tools like Ansys, Siemens and Cadence.
• Extensive hands-on experience in memory systems package design, signaling, IO design, PDN design.
• Deep understanding of memory timing, signaling, power, package process technology.
• Working knowledge of EDA tools for design, analysis and simulation of electronic packaging, including but not limited to Cadence, Siemens and Ansys tools.
• Experience applying AI or LLMs for engineering efficiency.

Responsibilities

• Define next-generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance.
• Lead cross-stack co-optimization across silicon, package, board, and system with package centric solutions approach
• Drive long-term memory technology packaging strategy and influence industry standards
• Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge‑AI and datacenter memory products
• Serve as a technical interface to internal partners, customers, BUs, senior leaders.
• Develop AI based EDA and internal automation tool sets for enhancing design cycle efficiency.
• Develop measurement automation for incoming substrate materials.

Skills

Strong analytical and problem-solving

Effective cross-functionalColla

Data-driven mindset

Detail-oriented

Education

Master’s degree or equivalent in EE, CE, CS, or related field

PhD in a related technical field

Tools

JMP

Python

MATLAB

Cadence

Ansys

Siemens

Job description

Micron Technology, Inc. in Singapore is seeking a Package Pathfinding Architect to define next-generation memory packaging architectures, optimizing speed, bandwidth, power, and thermal performance across silicon, package, and system levels.

You will collaborate with silicon, board, and system design teams and key customers to translate long-term packaging roadmaps into scalable products, including AI-enabled design automation and measurement tooling.