Memory Packaging Pathfinding Architect: Edge-Datacenter

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 150,000 - 210,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte. Ltd. is seeking a Package Pathfinding Architect to define next‑generation package pathfinding and system architectures for memory products.

You will lead cross‑stack optimization across silicon, package, board and system with a package‑centric approach to boost speed, bandwidth and power performance, spanning datacenter to edge-AI contexts. You will drive long‑term packaging strategy, interface with customers and senior leaders, and collaborate with

Qualifications

• Master’s degree in EE, CE, CS or related field.
• 5+ years of experience in package design and memory systems.
• Hands-on memory systems package design, signaling, IO, PDN.
• Deep understanding of memory timing, signaling, power and process tech.
• Experience with EDA tools: Cadence, Siemens, Ansys.
• Experience applying AI/LLMs for engineering efficiency.

Responsibilities

• Define next-generation package pathfinding and system architectures for speed, bandwidth, power, capacity, thermal and electrical performance.
• Lead cross-stack co-optimization across silicon, package, board and system with a package-centric approach.
• Drive long-term memory technology packaging strategy and influence industry standards.
• Collaborate with silicon and system design teams and customers for disruptive solutions in edge-AI and datacenter memory.
• Serve as a technical interface to internal partners, customers and senior leaders.
• Develop AI-based EDA and internal automation tool sets to enhance design cycle efficiency.
• Develop measurement automation for incoming substrate materials.

Skills

Memory timing understanding

Memory system design

Signal integrity concepts

Data analysis

Education

Master’s degree in EE/CE/CS or related field

Tools

Cadence

Siemens

Ansys

Job description

Micron Semiconductor Asia Operations Pte. Ltd. is seeking a Package Pathfinding Architect to define next‑generation package pathfinding and system architectures for memory products.

You will lead cross‑stack optimization across silicon, package, board and system with a package‑centric approach to boost speed, bandwidth and power performance, spanning datacenter to edge-AI contexts. You will drive long‑term packaging strategy, interface with customers and senior leaders, and collaborate with