Mechanical Design Technician

techware Group; Singapore; On-site; SGD 60,000 - 90,000; Full time

Benefits offered by this job

Bonus

Annual Leave

Training Provided

Medical Insurance

Job summary

techware Group is seeking a Mechanical Design Engineer/Drafter (Semiconductor Tooling) fluent in Mandarin to design and develop machines and mechanical systems in a fast-paced environment.

The role involves 3D/2D drawings, tolerance analysis, BOM preparation, and close collaboration with Electrical, Vision and Software engineers. Candidates should have at least 3 years of relevant experience and be willing to work extended hours during critical project phases.

Qualifications

• Diploma or degree in Mechanical Engineering.
• Minimum 3 years of design experience in semiconductor machines or automation.
• Experience with high-speed pick-and-place systems, flip chip bonders, die attach machines, and lamination machines is a plus.
• Strong fundamentals in mechanical concepts and stack tolerance knowledge.

Responsibilities

• Design and development of machines and mechanical systems.
• Planning, scheduling and costing of machines and mechanical modules.
• Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation.
• Working closely with electrical, vision and software engineers.
• Willing to work extended hours in critical phases of project execution.

Skills

Mechanical design

3D/2D CAD

Tolerance analysis

Creo

Team collaboration

Problem solving

Education

Diploma or Degree in Mechanical Engineering

Tools

Creo

Job description

Job Responsibility

Mechanical Design Engineer/Drafter (Semiconductor Tooling, Mandarin Speaker).

• Design and development of Machines and mechanical systems.
• Planning, Scheduling and Costing of Machines and Mechanical Modules.
• Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation.
• Working closely with Electrical, Vision and Software Engineers.
• Willing to work extended hours in critical phases of project execution.

Job Requirements

• Diploma or Degree in Mechanical Engineering or related Technical disciplines.
• Minimum 3 years of design experiences in semiconductor machines or automations.
• Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
• Strong fundamentals in mechanical concepts and problem-solving skills, including knowledge in stack tolerance.
• Proficiency with Creo is a must.
• Experience with vision application, thermal modelling, calculation and measurement techniques would be an advantage.
• Self-motivated individual who is action/results oriented, independent, and flexible, with a passion for developing technical excellence products.
• Willingness to get hands-on during development cycle.
• Excellent communication skills, with cross-cultural awareness and understanding.
• Able to work under tight schedules.

Job Benefits

• Bonus
• Annual Leave
• Training Provided
• Medical Insurance