Mechanical Design Engineer - TCB - Flip-chip - Die-bonding - Up to $9k - JL99

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 67,000 - 100,000; Full time

Job summary

The Supreme HR Advisory Pte. Ltd. in Singapore is seeking a Mechanical Design Engineer/Senior Mechanical Design Engineer to join our team focused on semiconductor equipment development.

You will design mechanical systems, create 3D models, drawings, BOMs, and technical documentation to support wafer handling and die transfer modules. Ideal candidates hold a diploma or bachelor's in mechanical engineering and have about 2+ years of experience in precision automation or semiconductor

Qualifications

• Diploma or bachelor's degree in Mechanical Engineering, Mechatronics, or a related discipline.
• Approximately 2+ years of mechanical design experience in semiconductor equipment or precision automation.
• Proficiency with 3D CAD software (Creo, SolidWorks, Inventor, CATIA, NX, or equivalent).
• Ability to prepare detailed manufacturing and assembly drawings.
• Knowledge of tolerances, GD&T, bearings, linear-motion components, and fabrication processes.

Responsibilities

• Design mechanical systems and modules for semiconductor packaging equipment, including wafer handling and die transfer mechanisms.
• Develop 3D models, detailed drawings, BOMs, and technical documentation.
• Conduct tolerance stack-up and design reviews for precision assemblies.
• Collaborate with process, electrical, software, and manufacturing teams throughout development and qualification.
• Support assembly, alignment, testing, troubleshooting, and design improvements.
• Maintain engineering documentation and change-control records.

Job description

Position title

Mechanical Design Engineer / Senior Mechanical Design Engineer

Location

Admirax St (Sembawang)

Working Days

5 Day A Week

Working hours

9:00am - 6:00pm

Salary

SGD 6,000 - SGD 9,000/month (Based on experience and technical capability)

Responsibilities

Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.

Develop mechanical concepts, 3D models, detailed drawings, assembly drawings, BOMs, and technical documentation.

• Wafer handling systems
• Substrate, strip, panel, or glass-panel handling systems
• Die ejection, die pickup, and die transfer mechanisms
• Precision XY, XYZ, XYZT, and multi-axis positioning stages
• Bondheads and thermal bondheads
• Micro-Z, force-control, compliance, and tip-tilt mechanisms
• Heating, cooling, vacuum, gas, and thermal isolation structures
• Conversion kits, change parts, fixtures, tooling, nests, and bond tools

Select suitable mechanical and motion components, including bearings, linear guides, motors, encoders, actuators, load cells, heaters, sensors, springs, and flexures.

Conduct tolerance stack-up and design reviews for critical precision assemblies.

Consider positioning accuracy, repeatability, structural stiffness, vibration, thermal expansion, force transmission, alignment, and serviceability in the design.

Work closely with process, electrical, software, vision, motion-control, manufacturing, procurement, and service teams.

Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification.

Investigate machine problems and implement practical design improvements.

Improve existing modules for better accuracy, reliability, cycle time, manufacturability, and cost.

Maintain proper engineering documentation and design-change records.

Requirements

Diploma or bachelor's degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or a related discipline.

Approximately 2 or more years of mechanical design experience in semiconductor equipment, precision automation, machine building, motion systems, or related industries.

Proficiency in 3D mechanical CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.

Able to prepare detailed manufacturing and assembly drawings.

Good understanding of:

• Fits and tolerances
• GD&T
• Bearings and linear-motion components
• Machining and fabrication processes
• Material selection and surface treatment
• Mechanical assembly and alignment

Able to develop practical mechanism concepts rather than only produce drawings from instructions.

Willing to support machine assembly, debugging, testing, and continuous improvement.

Experience in semiconductor packaging or semiconductor automation equipment.

Experience designing precision, high-stiffness, or thermally stable machine modules.

Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity.

Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment.

Experience with tolerance analysis, FEA, thermal simulation, or structural analysis.

Experience taking a module from concept through assembly, testing, and customer acceptance.

Familiarity with DFM, DFA, cost reduction, and engineering change control.

Experience with prototype, customised, or first-of-a-kind equipment development.