Semiconductor Packaging Mechanical Design Engineer (TCB / Die Handling)- YZ11

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 67,000 - 1,205,000; Full time

Job summary

The Supreme HR Advisory Pte. Ltd. is recruiting a Mechanical Design Engineer / Senior Mechanical Design Engineer for its Admiralty site in Singapore.

The role offers a 5-day work week and standard hours, focusing on designing mechanical systems for advanced semiconductor packaging equipment. Responsibilities include developing 3D models, drawings, BOMs, and documentation; collaborating with process, electrical, software, and manufacturing teams; and supporting assembly, testing, and

Qualifications

• Diploma or bachelor’s in Mechanical Engineering or related field.
• 2+ years mechanical design experience in semiconductor equipment or related industry.
• Proficient in Creo, SolidWorks, Inventor, CATIA, NX or equivalent.
• Ability to prepare detailed manufacturing and assembly drawings.
• Knowledge of fits, tolerances, GD&T, and bearings/linear-motion components.

Responsibilities

• Design mechanical systems for semiconductor packaging equipment.
• Develop 3D models, drawings, BOMs, and documentation.
• Collaborate with process, electrical, software, and manufacturing teams.
• Support assembly, alignment, testing, and customer qualification.
• Improve modules for accuracy, reliability, and cost.

Skills

3D CAD

Tolerance analysis

GD&T

Mechanical design

Semiconductor equipment

Team collaboration

Education

Bachelor's degree in Mechanical Engineering

Diploma or related discipline

Tools

Creo

SolidWorks

Inventor

CATIA

NX

Job description

Position title

Mechanical Design Engineer / Senior Mechanical Design Engineer

Location: Admiralty

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : SGD 6,000 - SGD 9,000/month (Based on experience and technical capability).

Responsibilities

• Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.
• Develop mechanical concepts, 3D models, detailed drawings, assembly drawings, BOMs, and technical documentation.
• Design equipment modules such as:Wafer handling systemsSubstrate, strip, panel, or glass-panel handling systemsDie ejection, die pickup, and die transfer mechanismsPrecision XY, XYZ, XYZT, and multi-axis positioning stagesBondheads and thermal bondheadsMicro-Z, force-control, compliance, and tip-tilt mechanismsHeating, cooling, vacuum, gas, and thermal isolation structuresConversion kits, change parts, fixtures, tooling, nests, and bond tools
• Select suitable mechanical and motion components, including bearings, linear guides, motors, encoders, actuators, load cells, heaters, sensors, springs, and flexures.
• Conduct tolerance stack-up and design reviews for critical precision assemblies.
• Consider positioning accuracy, repeatability, structural stiffness, vibration, thermal expansion, force transmission, alignment, and serviceability in the design.
• Work closely with process, electrical, software, vision, motion-control, manufacturing, procurement, and service teams.
• Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification.
• Investigate machine problems and implement practical design improvements.
• Improve existing modules for better accuracy, reliability, cycle time, manufacturability, and cost.
• Maintain proper engineering documentation and design-change records.

Requirements

• Diploma or bachelor's degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or a related discipline.
• Approximately 2 or more years of mechanical design experience in semiconductor equipment, precision automation, machine building, motion systems, or related industries.
• Proficiency in 3D mechanical CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.
• Able to prepare detailed manufacturing and assembly drawings.
• Good understanding of:
  • Fits and tolerances
  • GD&T
  • Bearings and linear-motion components
  • Machining and fabrication processes
  • Material selection and surface treatment
  • Mechanical assembly and alignment
• Able to develop practical mechanism concepts rather than only produce drawings from instructions.
• Willing to support machine assembly, debugging, testing, and continuous improvement.
• Experience in semiconductor packaging or semiconductor automation equipment.
• Experience designing precision, high-stiffness, or thermally stable machine modules.
• Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity.
• Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment.
• Experience with tolerance analysis, FEA, thermal simulation, or structural analysis.
• Experience taking a module from concept through assembly, testing, and customer acceptance.
• Familiarity with DFM, DFA, cost reduction, and engineering change control.
• Experience with prototype, customised, or first-of-a-kind equipment development.