Mechanical Design Engineer (Senior / Semiconductor / TCB)

The Supreme HR Advisory Pte Ltd; Singapore; On-site; SGD 67,000 - 100,000; Full time

Job summary

The Supreme HR Advisory Pte Ltd is seeking a Mechanical Design Engineer / Senior Mechanical Design Engineer in Singapore to design mechanical systems for advanced semiconductor equipment.

You will develop 3D models, detailed drawings, BOMs, and technical documentation, while collaborating with process, electrical, software, and manufacturing teams.

Qualifications

• Diploma or bachelor’s degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or related discipline.
• Approximately 2+ years of mechanical design experience in semiconductor equipment or related industries.
• Proficiency in 3D CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalents.
• Able to prepare detailed manufacturing and assembly drawings.
• Good understanding of fits and tolerances, GD&T, bearings and linear-motion components, machining and fabrication processes, materials, and assembly.

Responsibilities

• Design mechanical systems and modules for semiconductor packaging equipment.
• Develop 3D models, drawings, BOMs, and documentation.
• Design wafer handling, substrate, die handling, and precision positioning systems.
• Select mechanical and motion components including bearings, actuators, and sensors.
• Conduct tolerance stack-up and design reviews for precise assemblies.
• Collaborate with process, electrical, software, and manufacturing teams.
• Support assembly, alignment, testing, and customer qualification.
• Investigate issues and implement practical design improvements.
• Maintain engineering documentation and design-change records.

Skills

3D CAD

GD&T

Tolerance analysis

Mechanical design

Assembly drawings

Education

Diploma or Bachelor's in Mechanical Engineering

Tools

Creo

SolidWorks

Inventor

CATIA

NX

Job description

Position title : Mechanical Design Engineer / Senior Mechanical Design Engineer

• Admirax St

• 5 Day A Week (9:00am - 6:00pm)

• SGD 6,000 – SGD 9,000/month (Based on experience and technical capability)

Responsibilities

• Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.

• Develop mechanical concepts, 3D models, detailed drawings, assembly drawings, BOMs, and technical documentation.

• Design equipment modules such as:

  • Wafer handling systems
  • Substrate, strip, panel, or glass-panel handling systems
  • Die ejection, die pickup, and die transfer mechanisms
  • Precision XY, XYZ, XYZT, and multi-axis positioning stages
  • Bondheads and thermal bondheads
  • Micro-Z, force-control, compliance, and tip-tilt mechanisms
  • Heating, cooling, vacuum, gas, and thermal isolation structures
  • Conversion kits, change parts, fixtures, tooling, nests, and bond tools

• Select suitable mechanical and motion components, including bearings, linear guides, motors, encoders, actuators, load cells, heaters, sensors, springs, and flexures.

• Conduct tolerance stack-up and design reviews for critical precision assemblies.

• Consider positioning accuracy, repeatability, structural stiffness, vibration, thermal expansion, force transmission, alignment, and serviceability in the design.

• Work closely with process, electrical, software, vision, motion-control, manufacturing, procurement, and service teams.

• Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification.

• Investigate machine problems and implement practical design improvements.

• Improve existing modules for better accuracy, reliability, cycle time, manufacturability, and cost.

• Maintain proper engineering documentation and design-change records.

Candidates are not expected to have experience in all the above areas. Strong design capability in one or more relevant modules is sufficient.

Requirements

1. TCB equipment

   • Thermo-Compression Bonding
   • Chip-to-substrate, chip-to-wafer, or chip-to-panel bonding
   • HBM, large-die, fluxless bonding, or advanced packaging equipment

2. Flip-chip or die-bonding equipment

   • Flip-chip bonders
   • Die bonders
   • Die attach or semiconductor pick-and-place systems

3. Semiconductor handling equipment

   • Wafer handling
   • Substrate, strip, panel, or glass-panel handling
   • Die ejection, die pickup, or die transfer
   • EFEM, robot, aligner, elevator, buffer, or transfer mechanisms

4. Precision positioning stages

   • XY, XYZ, XYZT, or multi-axis stages
   • Gantry systems
   • Cross-roller-bearing stages
   • Flexure-guided mechanisms
   • High-accuracy motion platforms

5. Bondhead or thermal module design

   • Bondheads
   • Thermal bondheads
   • Force-control mechanisms
   • Micro-Z systems
   • Load-cell integration
   • Heating and cooling assemblies
   • Parallelism or tip-tilt correction systems

6. Conversion kits, tooling, and fixtures

   • Machine conversion kits
   • Product change parts
   • Vacuum tooling
   • Bond tools
   • Wafer, substrate, or panel fixtures
   • Calibration and alignment jigs

• Diploma or bachelor’s degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or a related discipline.

• Approximately 2 or more years of mechanical design experience in semiconductor equipment, precision automation, machine building, motion systems, or related industries.

• Proficiency in 3D mechanical CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.

• Able to prepare detailed manufacturing and assembly drawings.

• Good understanding of:

  • Fits and tolerances
  • GD&T
  • Bearings and linear-motion components
  • Machining and fabrication processes
  • Material selection and surface treatment
  • Mechanical assembly and alignment

• Able to develop practical mechanism concepts rather than only produce drawings from instructions.

• Willing to support machine assembly, debugging, testing, and continuous improvement.

• Experience in semiconductor packaging or semiconductor automation equipment.

• Experience designing precision, high-stiffness, or thermally stable machine modules.

• Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity.

• Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment.

• Experience with tolerance analysis, FEA, thermal simulation, or structural analysis.

• Experience taking a module from concept through assembly, testing, and customer acceptance.

• Familiarity with DFM, DFA, cost reduction, and engineering change control.

• Experience with prototype, customised, or first-of-a-kind equipment development.