Mechanical Design Engineer (Semiconductor Tooling Design) - LCYL

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 39,000 - 67,000; Full time

Job summary

THE SUPREME HR ADVISORY PTE. LTD. is seeking a Mechanical Design Engineer to design and develop semiconductor tooling and mechanical systems.

The role emphasizes 3D/2D drawings, tolerance analysis, and BOM preparation, with collaboration across Electrical, Vision, and Software teams. Requirements include a Diploma or Degree in Mechanical Engineering and at least 3 years of design experience in semiconductor tooling.

Qualifications

• Diploma or Degree in Mechanical Engineering or related technical disciplines.

Responsibilities

• Design and development of Semiconductor Tools and mechanical systems.
• Planning, Scheduling and Costing of Tools and Mechanical Modules
• Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation.
• Working closely with Electrical, Vision and Software Engineers.
• Willing to work extended hours in critical phases of project execution.

Skills

3D & 2D drawing

Tolerance analysis

BOM preparation

Education

Diploma or Degree in Mechanical Engineering

Tools

CAD Software

Thermal modelling

Vision applications

Job description

Mechanical Design Engineer(Semiconductor Tooling Design)

5 days,8.30am-6.15pm

Salary: $3500- $6000

Location:11 Fourth Lok Yang Road, Singapore 629708 (Joo Koon)

Company background:

Specializes in Semiconductor Backend Tooling including Die Attach Tools, Wire Bond Tools & Bond Test Tools

Job Responsibilities:

• Design and development of Semiconductor Tools and mechanical systems.
• Planning, Scheduling and Costing of Tools and Mechanical Modules
• Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation.
• Working closely with Electrical, Vision and Software Engineers.
• Willing to work extended hours in critical phases of project execution.

Job Requirements:

• Diploma or Degree in Mechanical Engineering or related Technical disciplines.
• Minimum 3 years of design experiences in semiconductor tooling
• Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus
• Proficiency with CAD Softwareis a must.
• Experience with vision application, thermal modelling, calculation and measurement techniques would be an advantage.