Lead Scientist, Advanced Packaging & Heterogeneous Integration

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

Institute of Microelectronics (IME) in Singapore seeks a Principal Scientist to advance state-of-the-art advanced packaging technologies. You will lead development of heterogenous integration flows for 2.5D/3D packaging and perform reliability characterization.

The role involves mentoring researchers, collaborating with external partners, and driving high-impact projects across flip-chip, FOWLP, interposer, and bonding technologies.

Qualifications

• PhD in a relevant field.
• 5+ years of experience in advanced packaging such as FOWLP, Flip Chip bonding, 2.5D/3D integration.
• Strong analytical and problem-solving skills with data analysis, interpretation and DOE.

Responsibilities

• Develop new process integration flows for flip-chip, hybrid bonding, and FOWLP-based applications.
• Conceive and plan projects involving new materials and advanced process-integration approaches.
• Collaborate with internal and external partners to address technology roadmaps and business challenges.
• Lead high-impact projects with manageable risks and mentor less-experienced colleagues.
• Investigate and refine interposer fabrication integration flows with focus on new materials and TSV fill applications.
• Manage wafer-level and die-level warpage to meet process requirements.
• Optimize die-bonding processes and bonding materials.
• Conduct engineering experiments for process characterization to drive quality and yield improvements.
• Perform reliability characterization of advanced packages to ensure robustness.
• Act as SME for internal and external stakeholders and mentor young talent.

Skills

Advanced packaging expertise

FOWLP / Flip Chip bonding

2.5D/3D heterogeneous integration

Data analysis & DOE

Project leadership

Education

PhD in Materials Science/Engineering or related

Job description

Institute of Microelectronics (IME) in Singapore seeks a Principal Scientist to advance state-of-the-art advanced packaging technologies. You will lead development of heterogenous integration flows for 2.5D/3D packaging and perform reliability characterization.

The role involves mentoring researchers, collaborating with external partners, and driving high-impact projects across flip-chip, FOWLP, interposer, and bonding technologies.