Senior Scientist, Advanced Packaging & Heterogeneous Integration

A*STAR - Agency for Science, Technology and Research

Singapore

Presencial

SGD 70.000 - 100.000

Jornada completa

14 días+

Consigue una respuesta de este empleador

Tu currículum y tu carta de presentación, adaptados exactamente a lo que buscan contratar.

Supera los filtros ATS

Ventajas ofrecidas por este puesto de trabajo

Access to advanced laboratories
Opportunities for professional growth

Descripción de la vacante

A*STAR - Agency for Science, Technology and Research in Singapore is seeking a passionate Scientist or Senior Scientist to lead advanced packaging research as a Process Integrator for Advanced Package Assembly. This role focuses on developing pioneering techniques in chip integration, requiring a PhD and 5-10 years of semiconductor industry experience, particularly in assembly processes. The position offers collaboration opportunities across multiple disciplines, access to state-of-the-art facilities, and engagement in cutting-edge research projects.

Formación

  • 5-10 years of experience in semiconductor industry.
  • Broad hands-on knowledge of package assembly processes.
  • Proven ability to work effectively in diverse environments.

Responsabilidades

  • Lead process capabilities development for micro bump bonding.
  • Develop integration approaches for novel system-in-package architectures.
  • Act as a subject matter expert for stakeholders.

Conocimientos

Process integration
Thermal compression bonding
Chip-to-wafer bonding
Analytical/problem-solving skills
Fail analysis flows

Educación

PhD in Materials Science & Engineering or related field

Herramientas

DOE
SPC (JMP/Minitab)

Descripción del empleo

A*STAR - Agency for Science, Technology and Research in Singapore is seeking a passionate Scientist or Senior Scientist to lead advanced packaging research as a Process Integrator for Advanced Package Assembly. This role focuses on developing pioneering techniques in chip integration, requiring a PhD and 5-10 years of semiconductor industry experience, particularly in assembly processes. The position offers collaboration opportunities across multiple disciplines, access to state-of-the-art facilities, and engagement in cutting-edge research projects.
Consigue la evaluación confidencial y gratuita de tu currículum.

o arrastra y suelta tu archivo aquí

Similar jobs

Puestos de trabajo similares que vale la pena comparar

Senior Research Engineer: 2.5D/3D Packaging & Chiplet ICs
Senior Research Engineer: 2.5D/3D Packaging & Chiplet ICs

A*STAR - Agency for Science, Technology and Research • Singapore

Presencial
SGD 70.000 - 100.000
Access to state-of-the-art facilities
Opportunity for professional growth
Collaborative work environment
Senior Scientist: 2.5D/3D Packaging & Hybrid Bonding
Senior Scientist: 2.5D/3D Packaging & Hybrid Bonding

A*STAR - Agency for Science, Technology and Research • Singapore

Presencial
SGD 40.000 - 80.000
Lead Principal Scientist, 3D IC/SiP Packaging Architect
Lead Principal Scientist, 3D IC/SiP Packaging Architect

A*STAR - Agency for Science, Technology and Research • Singapore

Presencial
SGD 140.000 - 190.000
Senior Research Engineer: Advanced Packaging Prototyping
Senior Research Engineer: Advanced Packaging Prototyping

A*STAR - Agency for Science, Technology and Research • Singapore

Presencial
SGD 70.000 - 110.000
Head of Advanced Process Modules (Semiconductors)
Head of Advanced Process Modules (Semiconductors)

A*STAR - Agency for Science, Technology and Research • Singapore

Presencial
SGD 120.000 - 200.000
Senior Advanced Packaging Design Enablement Engineer
Senior Advanced Packaging Design Enablement Engineer

A*STAR - Agency for Science, Technology and Research • Singapore

Presencial
SGD 110.000 - 170.000
Senior Bonding Engineer, Advanced Packaging & Tech Transfer
Senior Bonding Engineer, Advanced Packaging & Tech Transfer

A*STAR - Agency for Science, Technology and Research • Singapore

Presencial
SGD 70.000 - 90.000
Strategic Tech Marketing Lead, Advanced Packaging
Strategic Tech Marketing Lead, Advanced Packaging

A*STAR - Agency for Science, Technology and Research • Singapore

Presencial
SGD 60.000 - 100.000
Senior Wafer Bonding Engineer, Advanced Packaging R&D
Senior Wafer Bonding Engineer, Advanced Packaging R&D

A*STAR - Agency for Science, Technology and Research • Singapore

Presencial
SGD 90.000 - 130.000
Senior Scientist, Hybrid Bonding & Advanced Packaging
Senior Scientist, Hybrid Bonding & Advanced Packaging

A*STAR - Agency for Science, Technology and Research • Singapore

Presencial
SGD 120.000 - 180.000