Lead Principal Scientist, 3D IC/SiP Packaging Architect

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 140,000 - 190,000; Full time

Job summary

A*STAR – Agency for Science, Technology and Research is seeking a Principal/Senior Principal Scientist (Lead, 3D IC Package Integration) in Advanced Packaging. Lead the integration roadmap for wafer-level SiP solutions, driving heterogeneous integration via 3D stacking and photonic-electronic co-integration.

Build scalable micro-bump and hybrid bonding capabilities for next-gen HPC interconnects. The role demands a PhD with 10–15 years in semiconductor packaging, strong leadership, and a track

Qualifications

• PhD in Electronics, Electrical Engineering, Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or a related field.

Responsibilities

• Evaluate industry trends and define differentiated 3D packaging platform architectures.
• Define simple advanced packaging process integration flow with minimum steps and lowest cost.
• Identify tech gaps and set clear specs for process modules and accountability.

Skills

Leadership

Project management

People management

Strategic thinking

Data analysis

Education

PhD in Electronics / related field

Master's + 15 years in 2.5D/3D packaging

Job description

A*STAR – Agency for Science, Technology and Research is seeking a Principal/Senior Principal Scientist (Lead, 3D IC Package Integration) in Advanced Packaging. Lead the integration roadmap for wafer-level SiP solutions, driving heterogeneous integration via 3D stacking and photonic-electronic co-integration.

Build scalable micro-bump and hybrid bonding capabilities for next-gen HPC interconnects. The role demands a PhD with 10–15 years in semiconductor packaging, strong leadership, and a track