Senior Research Fellow — 2.5D/3D Packaging Lead

National University of Singapore; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

National University of Singapore is seeking a Senior Research Fellow in the Electrical and Computer Engineering Department on an Advanced Process Module. The role focuses on leading wafer processing and advanced packaging research, including 2.5D/3D integration and hybrid bonding technologies, in collaboration with industry partners and tool vendors.

The candidate will spearhead programs, drive innovation, and contribute to publications and patents while coordinating a cross-disciplinary team at

Qualifications

• Ph.D. or equivalent in Electrical, Electronics, Mechanical, Chemical Engineering, Physics, Materials Science or equivalent.
• 15+ years of industrial R&D or advanced research in wafer foundry process and semiconductor packaging.
• Experience in Silicon photonics integration including CPO and FAU.
• Proficiency in data analysis using statistical tools.
• Excellent communication and collaboration in a research environment.

Responsibilities

• Address key issues of state-of-the-art technologies in wafer processing and advanced packaging to improve capability, integration, reliability and scalability.
• Develop CoW and WoW hybrid bonding technologies and integration approaches for 2.5D/3D and heterogeneous integration.
• Develop innovative process and integration solutions for next-generation heterogeneous integration supporting 2.5D/3D packaging and chiplet integration.
• Contribute to invention disclosures, patent filings, and technology commercialization; publish in high-impact journals and present at conferences.

Skills

Data analysis

Communication

Leadership

Writing and presenting

Education

PhD or equivalent in engineering/science

Job description

National University of Singapore is seeking a Senior Research Fellow in the Electrical and Computer Engineering Department on an Advanced Process Module. The role focuses on leading wafer processing and advanced packaging research, including 2.5D/3D integration and hybrid bonding technologies, in collaboration with industry partners and tool vendors.

The candidate will spearhead programs, drive innovation, and contribute to publications and patents while coordinating a cross-disciplinary team at