Junior Package-Silicon Integration Engineer

Micron Technology; Singapore; On-site; SGD 52,000 - 76,000; Full time

Job summary

Micron Technology, Inc. is hiring an Engineer, Package–Silicon Integration to contribute to NAND package and silicon integration for next‑generation memory products. You will learn Micron’s development processes, work with cross‑functional teams, and build foundational skills under guidance.

This entry‑level role offers structured exposure to semiconductor packaging, integration risks, and collaboration within a high‑volume manufacturing environment.

Qualifications

• Bachelor's or Master's degree in Engineering in a related discipline.
• <2 years of relevant semiconductor or manufacturing experience.
• Foundational knowledge of semiconductor packaging and manufacturing processes.
• Ability to follow procedures and learn from feedback.

Responsibilities

• Support CPI assessments with data collection and basic analysis.
• Assist with wafer dicing, scribe design, and assembly topics.
• Participate in DFMEA/PFMEA activities and track actions.
• Collaborate with wafer fab, R&D, and manufacturing on yield and quality investigations.
• Prepare reports and technical documents for design reviews.

Skills

Semiconductor packaging basics

FMEA / DOE exposure

Data analysis

Excel / Word / PowerPoint

Team collaboration

Education

Engineering degree

Tools

Microsoft Excel

Microsoft Word

Microsoft PowerPoint

Job description

Micron Technology, Inc. is hiring an Engineer, Package–Silicon Integration to contribute to NAND package and silicon integration for next‑generation memory products. You will learn Micron’s development processes, work with cross‑functional teams, and build foundational skills under guidance.

This entry‑level role offers structured exposure to semiconductor packaging, integration risks, and collaboration within a high‑volume manufacturing environment.