Package-Silicon Integration Engineer - Early Career

Micron Memory Malaysia Sdn Bhd; Singapore; On-site; SGD 50,000 - 75,000; Full time

Job summary

Micron Memory Malaysia Sdn Bhd in Singapore is looking for an Engineer in Package Development Engineering for silicon integration. This is an early-career role focused on supporting NAND package and silicon integration for next-generation memory products.

The ideal candidate will possess a degree in Engineering and have fundamental knowledge of semiconductor manufacturing. You will benefit from mentoring while contributing to team objectives.

Qualifications

• Less than 2 years of relevant experience in semiconductor, materials, or manufacturing fields.
• Exposure to structured problem-solving methods through internships or academics.
• Willingness to learn new tools, processes, and technologies.

Responsibilities

• Support chip-package interaction assessments with data collection and analysis.
• Assist design engineers in wafer dicing and integration topics.
• Participate in DFMEA / PFMEA activities to track action items.

Skills

Fundamental understanding of semiconductor manufacturing

Basic proficiency in Microsoft Excel

Good written and verbal communication

Education

Bachelor’s or Master’s degree in Engineering

Tools

Microsoft Word

Microsoft PowerPoint

Job description

Micron Memory Malaysia Sdn Bhd in Singapore is looking for an Engineer in Package Development Engineering for silicon integration. This is an early-career role focused on supporting NAND package and silicon integration for next-generation memory products.

The ideal candidate will possess a degree in Engineering and have fundamental knowledge of semiconductor manufacturing. You will benefit from mentoring while contributing to team objectives.