Package Silicon Technology Node Development MTS Singapore, Singapore Posted 13 hours ago

Micron Technology, Inc; Singapore; On-site; SGD 150,000 - 230,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid time off

Paid holidays

Job summary

Micron Technology Singapore is seeking a highly skilled MTS to lead chip-package interaction (CPI) technology strategy for next-generation memory products. You will coordinate across Fab Process Integration, Package Design, and Global Quality to drive technology readiness and risk mitigation while delivering impactful results.

This senior role requires AI proficiency and strong cross-functional collaboration to influence silicon-node transitions and package integration.

Qualifications

• AI proficiency with AI-based workflows is a must.
• Experience in cross-functional collaboration across Fab Process Integration, Product Development, Package Design, Assembly Technology Development, and Global Quality.

Responsibilities

• Define and drive CPI technology strategy and roadmaps for next-generation memory products.
• Collaborate with global engineering teams to ensure robust technology readiness and mitigate risk.
• Lead execution excellence across silicon, package, and system-level integration.

Skills

AI proficiency

Cross-functional leadership

Job description

Req. ID: JR110255 Package Silicon Technology Node Development MTS

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron Technology is seeking an accomplished technical leader to join our Package Development Engineering (PDE) organization as Member of technical Staff (MTS).

In this role, you will define and drive chip-package interaction (CPI) technology strategy and roadmaps to enable advanced silicon node transitions in next-generation memory products. You will operate at the intersection of silicon, package, and system-level integration, ensuring robust technology readiness and risk mitigation across increasingly complex design and process landscapes. This is a high-impact, cross-functional leadership role, requiring close collaboration with global engineering teams spanning Fab Process Integration, Product Development, Package Design, Assembly Technology Development, and Global Quality. You will play a critical role in shaping future memory product success through technology innovation, risk management, and execution excellence.

AI-proficiency and leveraging AI-based workflows is must.

Job Profile(s):

Semiconductor Design Eng MTS

Relocation level: (TBD)

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.