Wafer Bonding Process Intern: Hands-On Growth

GlobalFoundries; Singapore; On-site; SGD 13,000 - 20,000; Full time

Job summary

A leading semiconductor foundry in Singapore is offering an internship focused on wafer bonding process control. Interns will analyze bonding parameters and provide recommendations for improvements while receiving mentorship and professional development opportunities. This position is for students pursuing a Bachelor's degree in relevant fields, with coding skills as a plus. The internship lasts 20-24 weeks, starting June 2026. Join us to kickstart your career in the semiconductor industry!

Qualifications

• Pursuing a relevant Bachelor's degree.
• No prior experience required, but coding skills are preferred.

Responsibilities

• Analyze various bonding parameters governing the bonding process.
• Provide recommendations for improvements based on findings.
• Gain exposure to industry practices in the semiconductor sector.

Skills

Coding skills for developing scripts

Understanding of semiconductor processes

Education

Pursuing Bachelor's Degree in EEE/Material Science/Chemical Engineering

Job description

A leading semiconductor foundry in Singapore is offering an internship focused on wafer bonding process control. Interns will analyze bonding parameters and provide recommendations for improvements while receiving mentorship and professional development opportunities. This position is for students pursuing a Bachelor's degree in relevant fields, with coding skills as a plus. The internship lasts 20-24 weeks, starting June 2026. Join us to kickstart your career in the semiconductor industry!