Flip Chip Bonding Process Engineer

Qualcomm; Singapore; On-site; SGD 61,000 - 100,000; Full time

Job summary

RF360 Singapore Pte., Ltd. is seeking a Hardware Engineer to plan, design, verify, and test electronic systems, including packaging and test systems across Digital/Analog/RF domains in a collaborative, fast-paced environment.

The role emphasizes process engineering support, continuous improvement, and audit readiness, with opportunities to drive yield, quality, and efficiency while working with production, quality, and planning teams in a dynamic semiconductor manufacturing setting.

Qualifications

• Bachelor’s degree in Engineering (Mechanical, Materials, Chemical, Manufacturing, or related) or similar.
• 2+ years as a Process Engineer in semiconductor assembly/backend manufacturing preferred.
• Fresh graduates with strong technical aptitude may be considered.

Responsibilities

• Provide engineering support for backend semiconductor packaging processes, including flip chip bonding, reflow soldering and plasma cleaning.
• Support daily production activities to achieve output, quality, efficiency, productivity, yield, cycle time, and safety targets.
• Monitor and analyse process data to identify trends, risks, and improvement opportunities.
• Lead troubleshooting and problem-solving activities for process abnormalities, yield loss, quality excursions, and production issues.
• Drive permanent corrective and preventive actions to resolve chronic process and quality issues.
• Evaluate new products, materials, and processes during pilot runs and ensure process readiness for production release.
• Work closely with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution.
• Maintain and ensure the relevance of Work Instructions, Control Plans, FMEA, and Process Control documents.
• Prepare production lines and process documentation for internal and external audits.
• Promote compliance with safety, quality, and manufacturing standards.
• Identify and implement improvement actions to enhance process stability, productivity, yield, and cost effectiveness.
• Apply SPC and MSA tools where applicable.
• Participate in cross-functional initiatives to improve manufacturing robustness and operational excellence.

Skills

Data analysis

Problem-solving

Communication skills

Cross-functional collaboration

SPC knowledge

MSA knowledge

Education

Bachelor's degree in Electrical/Electronics Engineering

Tools

PowerPoint

Excel

Word

Job description

Company:

RF360 Singapore Pte., Ltd.

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

Key Responsibilities:

Process Engineering & Manufacturing Support

• Provide engineering support for backend semiconductor packaging processes, including flip chip bonding, reflow soldering and plasma cleaning.
• Support daily production activities to achieve output, quality, efficiency, productivity, yield, cycle time, and safety targets.
• Monitor and analyse process data to identify trends, risks, and improvement opportunities.
• Lead troubleshooting and problem-solving activities for process abnormalities, yield loss, quality excursions, and production issues.
• Drive permanent corrective and preventive actions to resolve chronic process and quality issues.
• Evaluate new products, materials, and processes during pilot runs and ensure process readiness for production release.
• Work closely with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution.

Documentation, Compliance & Audit Support

• Maintain and ensure the relevance of Work Instructions, Control Plans, FMEA, and Process Control documents.
• Prepare production lines and process documentation for internal and external audits.
• Support audit follow-up actions and ensure timely closure of findings.
• Promote compliance with safety, quality, and manufacturing standards.

Continuous Improvement

• Identify and implement improvement actions to enhance process stability, productivity, yield, and cost effectiveness.
• Apply statistical and quality tools such as SPC, MSA, and structured problem-solving methods where applicable.
• Participate in cross-functional initiatives to improve manufacturing robustness and operational excellence.

Qualifications:

• Bachelor’s Degree in Engineering, preferably in Mechanical, Materials, Chemical, Manufacturing, or a related discipline.
• Preferably at least 2 years of relevant working experience as a Process Engineer in semiconductor assembly or backend manufacturing.
• Fresh graduates with strong technical aptitude and interest in semiconductor manufacturing may also be considered.

Required Skills & Competencies:

• Strong data analysis, problem-solving, and critical thinking skills.
• Good communication and collaboration skills, with the ability to work effectively with cross-functional teams.
• Good planning, organization, and follow-up skills.
• Ability to work under pressure and demonstrate strong commitment to achieving production and quality goals.
• Proficiency in Microsoft PowerPoint, Excel, and Word.
• Knowledge of statistical and quality tools such as SPC and MSA is preferred.

Ideal Candidate Profile:

• A proactive team player who is hands-on, detail-oriented, and comfortable working in a dynamic manufacturing environment.
• Able to adapt to changing priorities while maintaining focus on safety, quality, delivery, and continuous improvement.
• Passionate about semiconductor manufacturing and motivated to develop strong technical ownership of interconnect packages.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [e-mail] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.