Front-End Yield & Process Integration Engineer

Nutanix; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

Qualcomm is seeking a Hardware Engineer to plan, design, verify, and test electronic systems across Digital/Analog/RF/optical domains. The role focuses on yield improvement, process optimization, and manufacturing robustness for Front-End semiconductor processes.

The position requires a Bachelor’s degree in Electrical/Electronics/ Microelectronics or related fields and hands-on experience in wafer fabrication or high-volume electronics manufacturing. Collaboration with global teams is essential.

Qualifications

• Bachelor’s degree in Electrical Engineering, Electronics Engineering, Materials Engineering, Microelectronics, Semiconductor Engineering, or an equivalent discipline.

Responsibilities

• Lead Yield Improvement and Failure Analysis efforts to reduce scrap and defects.
• Design, execute, and analyze Design of Experiments to optimize front-end process conditions.
• Coordinate with process module engineers, manufacturing, quality, and equipment teams on yield excursions.
• Drive process changes through ECNs, Limited Change Requests, and qualification activities.
• Advance Process Transfer and Production Ramp for new products and technologies.
• Provide feedback on design for manufacturability to improve yield and reliability.
• Collaborate cross-functionally with Technology Development and other sites on industrialization projects.

Skills

Yield optimization

Data-driven analysis

Process engineering

Cross-functional collaboration

Design of Experiments

Statistical analysis

Root cause analysis

Education

Bachelor's degree in Electrical/Electronics/Microelectronics/ Semiconductor Engineering

Job description

Qualcomm is seeking a Hardware Engineer to plan, design, verify, and test electronic systems across Digital/Analog/RF/optical domains. The role focuses on yield improvement, process optimization, and manufacturing robustness for Front-End semiconductor processes.

The position requires a Bachelor’s degree in Electrical/Electronics/ Microelectronics or related fields and hands-on experience in wafer fabrication or high-volume electronics manufacturing. Collaboration with global teams is essential.