Engineer/Staff Engineer - Multi-Dies Physical Verification Engineer

PERSOL Singapore; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

PERSOL Singapore is seeking an experienced engineer to lead multi‑die physical verification sign‑off for 3D IC packaging, including 3D_Stack, 3D_PERC and 3D_ANT flows, in a dynamic tape‑out environment. You will work closely with Package Design, ESD, and PV teams to resolve integration issues and drive flow automation.

The ideal candidate has a strong background in 3D IC design concepts, backend IC flow, and scripting proficiency, with excellent problem‑solving and communication skills.

Qualifications

• Familiar with 3D IC design concepts (CoWoS, SoIC, EMIB)
• Proficient in script programming languages (Python, Tcl, Perl, or C-shell)
• Experience with IC design front-to-backend flow
• Strong UNIX (Linux) skills and environment familiarity
• Excellent communication, problem solving and analytical abilities

Responsibilities

• Multi‑Dies PV sign‑off for 3D_Stack, 3D_PERC, 3D_ANT in tape‑out
• Collaborate with Package Design Team to resolve multi‑dies integration issues
• Collaborate with ESD Team to run 3D_PERC flow
• Coordinate with Chip PV Team on active dies issues (DRC, LVS, ANT, ERC, ESD)
• Provide automation solutions to improve tape‑out flow efficiency
• Report on Tapeout PV issues

Skills

3D IC Design

Python scripting

UNIX/Linux

Problem solving

Communication

Education

Bachelor’s/Master’s Degree in Electrical/Electronic Engineering / Computer Science

Tools

Calibre

Job description

Job Description:

Responsible for Multi-Dies Physical Verification Sign-off in area of (3D_Stack, 3D_PERC, 3D_ANT) for tape-out.

Co-work with Package Design Team to resolve multi-dies integration issues.

Co-work with ESD Team to run 3D_PERC flow.

Coordinates with Chip PV Team on active dies related issues (DRC, LVS, ANT, ERC, ESD)

Provide automation solutions to improve efficiency in tape-out flow.

Report on Tapeout PV issues.

Requirements:

• Bachelor/Master's Degree in Electrical/Electronic Engineering / Computer Science
• Familiar with 3D IC Design, like CoWoS, SoIC, EMIB etc.
• Familiar with IC Design front-to-backend flow
• Preferably well-versed in Calibre
• Proficient in script programming, such as Python, Tcl, Perl or C-shell
• Proficient in UNIX (Linux) platforms
• Strong communication skills, problem solving and analytical skills.