Overview
Micron Technology, Inc. is a leading provider of memory solutions. This position is for a Dry Etch Engineer in the NAND Research & Development team.
Responsibilities
- Develop dry etch processes to meet the physical and electrical requirements of Micron’s products.
- Optimize dry etch processes to reduce cost, process variability, and improve process capability.
- Collaborate with process integration and other process development teams to develop innovative new solutions.
- Conduct root cause and failure mode analysis to understand limitations of current hardware and drive vendor solutions.
- Perform fundamental research to drive innovative solutions for next‑generation products.
- Maintain a technology development pilot manufacturing line.
- Support process transfer to production facilities (may require domestic and/or international travel).
Qualifications
- Aptitude for a research and development environment.
- Strong analytical and creative problem‑solving skills.
- Ability to resolve complex issues through root‑cause or model‑based problem solving.
- Working knowledge of statistics, preferably in statistical process control.
- Ability to work independently with minimal direction and focus on meeting commitments.
- Ability to multi‑task and manage numerous projects simultaneously.
- Academic background: Master’s or Ph.D. in Chemical, Mechanical, Electrical, Materials Science, Physics, Chemical Physics, Chemistry, Semiconductor Engineering, or related majors; or Bachelor’s degree in a related field with at least 3 years of relevant experience.
- Knowledge of thermodynamics, transport phenomena, dry etch processing, kinetic theory, or basic plasma physics.
- Basic data science skills, Python coding, or scripting—desirable.
- Strong computer skills, including proficiency with MS Office.
EEO Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.