Engineer , Pkg Reliability

Micron Technology, Inc; Singapore; On-site; SGD 70,000 - 90,000; Full time

Benefits offered by this job

Choice of medical, dental and vision plans

Robust paid time-off program

Paid holidays

Job summary

Micron Technology, Inc in Singapore is seeking a Global Quality Package Reliability Engineer to ensure the quality and reliability of semiconductor packages. You will coordinate package qualification activities for new products and provide recommendations on product release decisions based on reliability assessments.

The ideal candidate will have a background in engineering with experience in Micro Electronic Packaging, and possess strong analytical and problem-solving skills.

Qualifications

• 1–2 years of experience in Micro Electronic Packaging, Quality/Reliability Engineering, or Failure Analysis.
• Good knowledge of semiconductor package assembly processes.

Responsibilities

• Lead and coordinate package qualification efforts for new products.
• Develop reliability test plans to evaluate risks.
• Participate in root cause investigations for failures.

Skills

Knowledge of semiconductor package assembly processes

Understanding of thermo-mechanical interactions

Proficiency in reliability test methods

Analytical problem-solving abilities

Good written and verbal communication skills

Familiarity with backend manufacturing software systems

Understanding of quality management tools

Self-motivated and meticulous

Education

Bachelor’s or Master’s in Engineering

Job description

Req. ID: JR102510 Engineer , Pkg Reliability

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Position Overview

As a Global Quality (GQ) Package Reliability Engineer at Micron Technology Inc., you will be accountable for ensuring the quality and reliability of semiconductor packages across assigned product lines. This role encompasses end-to-end coordination of package qualification activities for new products, as well as for new designs, materials, or processes. You will provide recommendations on product release decisions based on comprehensive reliability test results.

Key Responsibilities

• New Product Qualification:
  • Lead and coordinate package qualification efforts for new products and process introductions.
  • Develop and implement robust qualification plans for new technologies and product developments.
  • Provide recommendation on new product release readiness based on reliability assessment outcomes.
• Reliability Test Planning and Execution:
  • Develop and devise reliability test plans to evaluate risks associated with excursions, conversions, and qualification issues.
  • Recommend effective screening methodologies for quality-sensitive lots.
  • Maintain and improve monitoring systems to ensure ongoing package quality.
• Root Cause Analysis and Corrective Actions:
  • Participate and drive in 8D problem‑solving processes.
  • Coordinate root cause investigations and corrective action plans for qualification failures and customer RMAs.
  • Prepare and present technical reports for internal and external partners.
• Customer and Partner Engagement:
  • Serve as a technical liaison for both internal teams and external customers regarding package-related quality and reliability concerns.
  • Evaluate customer requests for alignment with Micron’s quality policies.
  • Provide technical expertise and support for customer inquiries and requirements.

Qualifications and Skills

• Good knowledge of semiconductor package assembly processes and surface mount technology.
• Good understanding of thermo‑mechanical, mechanical and material interactions affecting reliability in IC components and PCB assemblies.
• Proficiency in industry‑standard reliability test methods, life prediction acceleration models, and statistical sampling.
• Good analytical problem‑solving abilities and project management skills.
• Good written and verbal communication skills in English and digital literacy are vital.
• Familiarity with backend manufacturing software systems.
• Understanding of quality management and statistical tools (e.g., SPC, FMEA, 8D CAR).
• Self‑motivated, meticulous, and capable of independent work and multi‑cross functional team.

Education and Experience

• Bachelor’s or Master’s in Engineering (Mechanical, Electronics, Materials Science) or related field.
• Minimum 1–2 years of experience in Micro Electronic Packaging, Quality/Reliability Engineering, or Failure Analysis.

Job Profile(s)

Quality Engineer 2

Relocation level: (TBD)

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.