Engineer , Pkg Reliability

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd is hiring a Global Quality Package Reliability Engineer to ensure the quality and reliability of semiconductor packages. This role involves leading package qualification efforts, developing reliability test plans, and engaging with internal teams and external customers.

The ideal candidate will have a Bachelor’s or Master’s degree in Engineering and at least 1–2 years of experience in quality or reliability engineering. Strong analytical and problem-solving skills are essential, along with good communication abilities in English.

Qualifications

• Good knowledge of semiconductor package assembly processes.
• Understanding of mechanical interactions affecting reliability in IC components.
• Proficiency in industry-standard reliability test methods.

Responsibilities

• Lead and coordinate package qualification efforts for new products.
• Develop reliability test plans to evaluate risks.
• Coordinate root cause investigations and corrective actions.

Skills

semiconductor package assembly processes

thermo-mechanical interactions

reliability test methods

analytical problem-solving skills

project management skills

communication skills in English

Education

Bachelor’s or Master’s in Engineering

Tools

backend manufacturing software systems

Job description

Position Overview

As a Global Quality (GQ) Package Reliability Engineer at Micron Technology Inc., you will be accountable for ensuring the quality and reliability of semiconductor packages across assigned product lines. This role encompasses end‑to‑end coordination of package qualification activities for new products, as well as for new designs, materials, or processes. You will provide recommendations on product release decisions based on comprehensive reliability test results.

Key Responsibilities

• New Product Qualification: Lead and coordinate package qualification efforts for new products and process introductions. Develop and implement robust qualification plans for new technologies and product developments. Provide recommendations on new product release readiness based on reliability assessment outcomes.
• Reliability Test Planning and Execution: Develop and devise reliability test plans to evaluate risks associated with excursions, conversions, and qualification issues. Recommend effective screening methodologies for quality‑sensitive lots. Maintain and improve monitoring systems to ensure ongoing package quality.
• Root Cause Analysis and Corrective Actions: Participate and drive in 8D problem‑solving processes. Coordinate root cause investigations and corrective action plans for qualification failures and customer RMAs. Prepare and present technical reports for internal and external partners.
• Customer and Partner Engagement: Serve as a technical liaison for both internal teams and external customers regarding package‑related quality and reliability concerns. Evaluate customer requests for alignment with Micron’s quality policies. Provide technical expertise and support for customer inquiries and requirements.

Qualifications and Skills

• Good knowledge of semiconductor package assembly processes and surface mount technology.
• Good understanding of thermo‑mechanical, mechanical and material interactions affecting reliability in IC components and PCB assemblies.
• Proficiency in industry‑standard reliability test methods, life prediction acceleration models, and statistical sampling.
• Good analytical problem‑solving abilities and project management skills.
• Good written and verbal communication skills in English and digital literacy are vital.
• Familiarity with backend manufacturing software systems.
• Understanding of quality management and statistical tools (e.g., SPC, FMEA, 8D CAR).
• Self‑motivated, meticulous, and capable of independent work and multi‑cross functional team collaboration.

Education and Experience

• Bachelor’s or Master’s in Engineering (Mechanical, Electronics, Materials Science) or related field.
• Minimum 1–2 years of experience in micro electronic packaging, quality/reliability engineering, or failure analysis.

Equal Employment Opportunity

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.