Semiconductor Die-Bonding Process Engineer

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 36,000 - 72,000; Full time

Job summary

THE SUPREME HR ADVISORY PTE. LTD. is seeking a skilled engineer to lead design, development, and optimization of software and hardware for advanced die bonding processes in Singapore.

You will translate customer requirements into customized packaging solutions and perform rigorous troubleshooting and validation. The role requires 3+ years in semiconductor packaging, strong knowledge of Flip-Chip/PoP packaging, and hands-on experience with motion control and equipment integration.

Qualifications

• Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
• 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
• Strong knowledge of advanced packaging technologies (Flip-Chip, PoP, wafer-level, or panel-level bonding).
• Experience with semiconductor equipment integration, motion control systems, and process development.
• Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing/lab environment.
• Willingness to travel for customer support and on-site installations.

Responsibilities

• Lead design, development, optimization, and validation of software and hardware applications for die bonding processes.
• Analyze customer requirements and translate into customized semiconductor packaging solutions with focus on process optimization and performance.
• Conduct troubleshooting and failure analysis of die attach tools, process issues, and software anomalies; implement corrective actions.
• Perform machine setup, calibration, and alignment to ensure optimal performance, repeatability, and yield.
• Develop test procedures, application recipes, and documentation for process qualification and validation; maintain logs and reports.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address challenges and implement improvements.
• Provide on-site support for complex customer applications, including training for field application engineers.
• Serve as interface between customers and the R&D team to guide tool enhancements and feature development.

Skills

Die bonding

Process optimization

Troubleshooting

Field support

Education

Bachelor’s or Master’s in Engineering

Tools

Motion control systems

Semiconductor equipment integration

Job description

THE SUPREME HR ADVISORY PTE. LTD. is seeking a skilled engineer to lead design, development, and optimization of software and hardware for advanced die bonding processes in Singapore.

You will translate customer requirements into customized packaging solutions and perform rigorous troubleshooting and validation. The role requires 3+ years in semiconductor packaging, strong knowledge of Flip-Chip/PoP packaging, and hands-on experience with motion control and equipment integration.