CMP Process Engineer - Yield & Tech Transfer

United Microelectronics Corporation (UMC); Singapore; Presencial; SGD 50.000 - 90.000; Jornada completa

Descripción de la vacante

United Microelectronics Corporation (UMC) is seeking a Process Engineer to advance thinning processes (GRINDER, CMP) for chip-to-wafer integration, driving experiments to stabilize processes and reduce cost while increasing yield.

You will collaborate with cross-functional teams to improve process performance, reliability and production readiness, and apply techniques such as DOE, SPC and FMEA to analyze issues, optimize processes and transfer technology across lines.

Formación

• Bachelor's Degree in Electronic/Electrical/Electronic/Mechanical Engineering, Materials Science or Physics.
• Demonstrated experience of at least 2 years in semiconductor foundry module process.
• Experience with 22/28 nm and below technology nodes is highly desirable.
• Strong understanding of process development, optimization and troubleshooting.
• Proven leadership skills in leading cross-functional teams and managing projects.

Responsabilidades

• Develop thinning process (GRINDER, CMP) for chip-to-wafer (C2W) with metrology.
• Define process specifications, conduct experiments, analyze data, and resolve process issues.
• Collaborate with cross-functional teams to improve process performance, reliability and production readiness.

Conocimientos

Process development

Problem solving

Leadership

Educación

Bachelor's Degree in Engineering

Herramientas

SPC

DOE

FMEA

Descripción del empleo

United Microelectronics Corporation (UMC) is seeking a Process Engineer to advance thinning processes (GRINDER, CMP) for chip-to-wafer integration, driving experiments to stabilize processes and reduce cost while increasing yield.

You will collaborate with cross-functional teams to improve process performance, reliability and production readiness, and apply techniques such as DOE, SPC and FMEA to analyze issues, optimize processes and transfer technology across lines.