Technology Development Diffusion Process Engineer

United Microelectronics Corporation (UMC); Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

UMC in Singapore is seeking a Process Engineer to develop expertise in semiconductor manufacturing and to improve conditions for advanced technologies through design and development experiments that deliver more stable processes at lower cost and higher yield. You will collaborate with manufacturers and engineers to formulate strategies and solutions to enhance the company’s efficiency.

Key responsibilities include process development, recipe optimization for pre-anneal compression, post-bond

Qualifications

• Bachelor's degree in engineering field.
• At least 2 years' experience in semiconductor foundry module process.
• Experience with 22/28nm and below is highly desirable.
• Strong understanding of process development, optimization and troubleshooting.
• Proven leadership skills in cross-functional teams and managing projects related to process improvement or technology transfer.

Responsibilities

• Process development & recipe optimization for Pre-anneal compression to improve chip-to-wafer contact after C2W bonding
• Post-bond anneal process development to strengthen bonding including process window definition and qualification support.
• Equipment/Process introduction & sustain: tool setup, qualification, documentation, SPC monitoring, and troubleshooting after ramp-up

Education

Bachelor's Degree in Electronic Engineering

Job description

UMC is a leading global semiconductor foundry company. As a Process Engineer, you will develop your expertise in the semiconductor industry and improve conditions for advanced technologies through design and development experiments to provide more stable processes at lower cost and higher yield. You will establish a cooperative atmosphere with various manufacturers and engineers to jointly develop strategies and solutions to improve the company's efficiency.

Key responsibilities

• Process development & recipe optimization for Pre-anneal compression to improve chip-to-wafer contact after C2W bonding
• Post-bond anneal process development to strengthen bonding including process window definition and qualification support.
• Equipment/Process introduction & sustain: tool setup, qualification, documentation, SPC monitoring, and troubleshooting after ramp-up

About you

• Bachelor's Degree in Electronic Engineering, Electrical Electronic Engineering, Chemical Engineering, Materials Science, Mechanical Engineering or Physics
• Demonstrated experience of at least 2 years in semiconductor foundry module process
• 22/28 nanometer and below advance technology nodes experience is highly desirable
• Strong understanding of process development, optimization and troubleshooting
• Proven leadership skills in leading cross-functional teams and managing projects related to process improvement or technology transfer
• Ability to analyze complex process issues, identify root causes, and implement effective solutions
• Experience skills including SPC, 8D reporting, DOE, FMEA and PMO is preferred