Chip Process Integration Engineer — Yield & Fab Operations

UNITED MICROELECTRONICS CORPORATION (Singapore Branch); Singapore; On-site; SGD 60,000 - 120,000; Full time

Job summary

UMC Singapore is seeking a Process Integration Engineer to maintain customer production by ensuring stable wafer quality and on-time wafer delivery through process integration and daily management.

This role supports new product tape-out procedures, improves yield, defines standard operating procedures, and collaborates with module engineers to meet customer requirements in a growing 22-nm fab in Singapore.

Qualifications

• Bachelor's degree in Electronic Engineering, Electrical Electronic Engineering, Physics, or Materials Science.
• Specialization in wafer chip or related semiconductor course.
• Excellent communication and time-management skills; strong sense of commitment.
• Semiconductor device process or foundry experience preferred.

Responsibilities

• Introduce customer's new product to FAB and support in new product's tape out procedures to ensure pilot success.
• Improve new Product yield and ensure mass production inline, WAT and CP yield stable
• Define standard operation procedure for daily job
• Co-work with module engineers to solve production related issues. (inline, WAT, yield and reliability...)
• Co-work with module engineers to develop customized process to meet customer special requirement

Skills

Communication skills

Time management

Education

Bachelor's degree in Electronic Engineering, Electrical Electronic Engineering, Physics, or Materials Science

Job description

UMC Singapore is seeking a Process Integration Engineer to maintain customer production by ensuring stable wafer quality and on-time wafer delivery through process integration and daily management.

This role supports new product tape-out procedures, improves yield, defines standard operating procedures, and collaborates with module engineers to meet customer requirements in a growing 22-nm fab in Singapore.